Patents by Inventor Javier A. Valenzuela

Javier A. Valenzuela has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230408545
    Abstract: The present disclosure relates to a heat exchanger for thermal control of heat producing devices. In accordance with aspects and embodiments, this is achieved in the present design by placing a parallel flow path near the heat sink in the test head with a variable restriction in each flow path. The restrictions may be operated in a complementary manner to keep the fluid inertia in the main supply and return lines substantially constant. This arrangement results in a test head with higher cooling capacity and quicker response time than achievable with prior art semiconductor testing systems. The test head includes a pair of nested pneumatic actuators having non-circular pistons designed to provide Z axis motion and roll and tilt compliance. The pneumatic actuator assembly may be mounted on segmented flexures to provide X axis, Y axis and yaw compliance.
    Type: Application
    Filed: June 21, 2023
    Publication date: December 21, 2023
    Applicant: Mikros Manufacturing, Inc.
    Inventors: Jesse D. McGowan, Lucas H. Rose, Timothy F. Ryan, Adam E. Sharp, Javier A. Valenzuela
  • Patent number: 11729945
    Abstract: An active device with a heat sink and low mechanical stress comprises a heat-producing substrate having a first thermal expansion coefficient; a heat sink having a second thermal expansion coefficient, wherein the first and second thermal expansion coefficients are different; and an interface between the heat-producing substrate and the heat sink formed so that, when the heat-producing substrate is operating at a predetermined temperature, a mechanical stress between the heat-producing substrate and the heat sink is substantially minimized. The heat sink has a yield strength that is lower than a yield strength of the heat-producing substrate and has been plastically deformed during fabrication to minimize the stress between the heat-producing substrate and the heat sink. Methods for fabricating the device are also disclosed.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: August 15, 2023
    Inventor: Javier A. Valenzuela
  • Patent number: 11033038
    Abstract: Atmospheric control valve device, part of an atmospheric control system built into a refrigerated container, whose installation requires minimal intervention and is self-sufficient, compact and reusable due to its long, cylindrical body that includes a battery compartment. The body also has a compartment for the electrical, electronic and sensor elements; a handling compartment for the elements that handle the device; a cover area to cover the container after removing the device; and a gas exchange compartment for two-way gas exchanges, controlled by a solenoid valve and by the differences in pressure that occur naturally within the refrigerated container.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: June 15, 2021
    Assignee: Liventus S.A.
    Inventors: Claudia Alejandra Mardones Soto, Francisco Javier Valenzuela Rollán, Mariano Pola Matte
  • Patent number: 10976101
    Abstract: A hatch device comprised by a main support body, a flow guide piece and an optional plug, which allows for minimum modifications in the service hatch cover's structure during installation.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: April 13, 2021
    Assignee: Liventus S.A.
    Inventors: Claudia Alejandra Mardones Soto, Francisco Javier Valenzuela Rollán, Mariano Pola Matte
  • Publication number: 20200340739
    Abstract: A hatch device comprised by a main support body (3), a flow guide piece (24) and an optional plug (30), which allows for minimum modifications in the service hatch cover's (2) structure during installation, as shown in FIG. 7/9.
    Type: Application
    Filed: August 3, 2016
    Publication date: October 29, 2020
    Applicant: Liventus S.A.
    Inventors: Claudia Alejandra MARDONES SOTO, Francisco Javier VALENZUELA ROLLÁN, Mariano POLA MATTE
  • Publication number: 20200137924
    Abstract: An active device with a heat sink and low mechanical stress comprises a heat-producing substrate having a first thermal expansion coefficient; a heat sink having a second thermal expansion coefficient, wherein the first and second thermal expansion coefficients are different; and an interface between the heat-producing substrate and the heat sink formed so that, when the heat-producing substrate is operating at a predetermined temperature, a mechanical stress between the heat-producing substrate and the heat sink is substantially minimized. The heat sink has a yield strength that is lower than a yield strength of the heat-producing substrate and has been plastically deformed during fabrication to minimize the stress between the heat-producing substrate and the heat sink. Methods for fabricating the device are also disclosed.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 30, 2020
    Applicant: MIKROS TECHNOLOGIES LLC
    Inventor: Javier A. Valenzuela
  • Publication number: 20190098910
    Abstract: Atmospheric control valve device, part of an atmospheric control system built into a refrigerated container, whose installation requires minimal intervention and is self-sufficient, compact and reusable due to its long, cylindrical body that includes a battery compartment. The body also has a compartment for the electrical, electronic and sensor elements; a handling compartment for the elements that handle the device; a cover area to cover the container after removing the device; and a gas exchange compartment for two-way gas exchanges, controlled by a solenoid valve and by the differences in pressure that occur naturally within the refrigerated container.
    Type: Application
    Filed: July 18, 2016
    Publication date: April 4, 2019
    Applicant: Liventus Chile S.A.
    Inventors: Claudia Alejandra Mardones Soto, Francisco Javier Valenzuela Rollán, Mariano Pola Matte
  • Patent number: 8474516
    Abstract: A micro-channel heat exchanger suited for use in large-area cold plates includes a heat transfer member having winding micro-channels, a manifold, and a cover plate. The micro-channels' winding design is defined by a nonlinear flow axis that may include a plurality of short pitch and small amplitude undulations, which cause the flow to change directions, as well as two or more large amplitude bends that cause the flow to reverse direction. In low flow per unit area applications, the winding micro-channels allow a user to customize the pressure drop to promote good flow distribution, to achieve improved heat transfer uniformity, and to enable the pressure drop to remain above the bubble point of the heat transfer structure to prevent gas blockage. The winding micro-channels also improve the heat transfer coefficient.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: July 2, 2013
    Assignee: Mikros Manufacturing, Inc.
    Inventor: Javier A. Valenzuela
  • Publication number: 20130056176
    Abstract: The heat exchanger with a controlled coefficient of thermal expansion (CTE) includes a low CTE thermal expansion control member operatively connected to a heat transfer member in order to restrain the lateral thermal expansion of the heat transfer member during use. The thermal expansion control member is placed outside the heat transfer path, so the thermal expansion control member can be made of a low thermal conductivity material without increasing the thermal resistance of the heat exchanger. The CTE of the thermal expansion control member is lower than that of the heat transfer member, so as to constrain lateral thermal expansion of the heat transfer member during operation. The difference between the CTE of the device being cooled and the heat transfer member, i.e. the CTE mismatch, is reduced over conventional heat exchangers by restraining the heat transfer member during operation.
    Type: Application
    Filed: August 27, 2012
    Publication date: March 7, 2013
    Applicant: MIKROS MANUFACTURING, INC.
    Inventor: Javier A. Valenzuela
  • Publication number: 20110226448
    Abstract: A winding channel heat exchanger includes a heat transfer member having winding channels, a manifold, and a cover plate. The channels' winding design is defined by a non-linear flow axis that may include a plurality of short pitch and small amplitude undulations, which cause the flow to change directions, and may also or alternatively include two or more large amplitude bends that cause the flow to reverse direction. In one embodiment, the undulations have varying amplitudes to increase the heat transfer coefficient along the length of the channel. The winding channels allow a user to customize the pressure drop to promote good flow distribution, to achieve improved heat transfer uniformity, and to improve the heat transfer coefficient.
    Type: Application
    Filed: May 25, 2011
    Publication date: September 22, 2011
    Applicant: MIKROS MANUFACTURING, INC.
    Inventor: Javier A. Valenzuela
  • Patent number: 7836943
    Abstract: A heat exchanger includes a heat transfer surface to transfer heat to or from a working fluid, a manifold region with a plurality of internal walls defining a plurality of inlet and outlet passages, and a heat transfer region disposed between the manifold region and the heat transfer surface. The internal walls are substantially normal to the heat transfer surface for directing working fluid in a normal direction, and include a plurality of alternating inflow and outflow portions in fluid communication with corresponding inlet passages and outlet passages. Adjacent inflow and outflow portions are in fluid communication with each other. A heat transfer structure is disposed in each of the plurality of inflow portions and extend between the internal walls of the inflow portion, the heat transfer structure being in thermal communication with the heat transfer surface to transfer heat between the working fluid and the heat transfer surface.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: November 23, 2010
    Assignee: Mikros Manufacturing, Inc.
    Inventor: Javier A. Valenzuela
  • Patent number: 7775261
    Abstract: A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid-vapor manifold in fluid communication with a capillary structure thermally connected to a heat transfer interface, all of which are disposed in a housing to contain the vapor. The liquid-vapor manifold transports liquid in a first direction and conducts vapor in a second, opposite direction. The manifold provides a distributed supply of fluid (vapor or liquid) over the surface of the capillary structure. In one embodiment, the manifold has a fractal structure including one or more layers, each layer having one or more conduits for transporting liquid and one or more openings for conducting vapor. Adjacent layers have an increasing number of openings with decreasing area, and an increasing number of conduits with decreasing cross-sectional area, moving in a direction toward the capillary structure.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: August 17, 2010
    Assignee: Mikros Manufacturing, Inc.
    Inventor: Javier A. Valenzuela
  • Publication number: 20100032147
    Abstract: A micro-channel heat exchanger suited for use in large-area cold plates includes a heat transfer member having winding micro-channels, a manifold, and a cover plate. The micro-channels' winding design is defined by a nonlinear flow axis that may include a plurality of short pitch and small amplitude undulations, which cause the flow to change directions, as well as two or more large amplitude bends that cause the flow to reverse direction. In low flow per unit area applications, the winding micro-channels allow a user to customize the pressure drop to promote good flow distribution, to achieve improved heat transfer uniformity, and to enable the pressure drop to remain above the bubble point of the heat transfer structure to prevent gas blockage. The winding micro-channels also improve the heat transfer coefficient.
    Type: Application
    Filed: August 8, 2008
    Publication date: February 11, 2010
    Applicant: MIKROS MANUFACTURING, INC.
    Inventor: Javier A. Valenzuela
  • Publication number: 20080066894
    Abstract: A normal-flow heat exchanger (NFHX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The NFHX comprises a core (130) having a heat-transfer surface (128), a length and a width. An inlet plenum (124) is located at one end of the length, and an outlet plenum (126) is located at the opposite end of the length. A plurality of inlet manifolds (140) extend the length of the core, and a plurality of outlet manifolds (142) extend the length of the core and are located alternatingly with the inlet manifolds across the width of the core. A plurality of interconnecting channels (144) each fluidly communicate with a corresponding inlet manifold and the two outlet manifolds located immediately adjacent that inlet manifold. A heat exchanger fin (154) is generally located between each pair of immediately adjacent interconnecting channels. In one embodiment, the core comprises a plurality of plate pairs (132) each comprising a heat exchanger plate (136) and a spacer plate (138).
    Type: Application
    Filed: November 12, 2007
    Publication date: March 20, 2008
    Applicant: MIKROS MANUFACTURING, INC.
    Inventor: Javier Valenzuela
  • Patent number: 7302998
    Abstract: A heat exchanger (120) includes a core (130) containing inlet manifold (140), outlet manifold (126), interconnecting channels (144) and a heat-transfer surface (128). Each interconnecting channel fluidly communicates at one end with a corresponding inlet manifold and at the other end with the two outlet manifolds located adjacent that inlet manifold. The inlet manifolds are located distal from the heat-transfer surface. The interconnecting channels are configured such that substantially all of the heat collected by a working fluid is collected as the working fluid flows from the inlet manifolds away from the heat-transfer surface in a direction substantially normal to the heat-transfer surface.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: December 4, 2007
    Assignee: Mikros Manufacturing, Inc.
    Inventor: Javier A. Valenzuela
  • Patent number: 7278474
    Abstract: A heat exchanger (HX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The HX comprises a core (130) having a heat transfer surface (128), a length and a width. Inlet manifolds (140) and outlet manifolds (142) located alternatingly across the width of the core extend the length of the core. Interconnecting channels (144) each fluidly communicate with a corresponding outlet manifold and the two inlet manifolds located immediately adjacent that outlet manifold. Heat exchanger fin (154) in thermal communication with the heat transfer surface (128) generally defines the surface of the interconnecting channels. A pathway directs the working fluid first towards and then away from heat transfer surface (128) in a direction substantially normal to the heat transfer surface. Heat is transferred to or from the working fluid from heat transfer fin (154) as the fluid flows toward and away from the heat transfer surface.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: October 9, 2007
    Assignee: Mikros Manufacturing, Inc.
    Inventors: Javier A. Valenzuela, Thomas J. Jasinski
  • Publication number: 20070017662
    Abstract: A heat-exchanger (HX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The HX comprises a core (130) having a heat transfer surface (128), a length and a width. Inlet manifolds (140) and outlet manifolds (142) located alternatingly across the width of the core extend the length of the core. Interconnecting channels (144) each fluidly communicate with a corresponding outlet manifold and the two inlet manifolds located immediately adjacent that outlet manifold. Heat exchanger fin (154) in thermal communication with the heat transfer surface (128) generally defines the surface of the interconnecting channels. A pathway directs the working fluid first towards and then away from heat transfer surface (128) in a direction substantially normal to the heat transfer surface. Heat is transferred to or from the working fluid from heat transfer fin (154) as the fluid flows toward and away from the heat transfer surface.
    Type: Application
    Filed: August 30, 2005
    Publication date: January 25, 2007
    Applicant: Mikros Manufacturing, Inc.
    Inventor: Javier Valenzuela
  • Publication number: 20050230085
    Abstract: A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid-vapor manifold in fluid communication with a capillary structure thermally connected to a heat transfer interface, all of which are disposed in a housing to contain the vapor. The liquid-vapor manifold transports liquid in a first direction and conducts vapor in a second, opposite direction. The manifold provides a distributed supply of fluid (vapor or liquid) over the surface of the capillary structure. In one embodiment, the manifold has a fractal structure including one or more layers, each layer having one or more conduits for transporting liquid and one or more openings for conducting vapor. Adjacent layers have an increasing number of openings with decreasing area, and an increasing number of conduits with decreasing cross-sectional area, moving in a direction toward the capillary structure.
    Type: Application
    Filed: March 8, 2005
    Publication date: October 20, 2005
    Inventor: Javier Valenzuela
  • Patent number: 6935411
    Abstract: A heat exchanger (120) comprising a core (130) containing inlet manifolds (140), outlet manifold (126) and interconnecting channels (144) and having a heat-transfer surface (128). Each interconnecting channel fluidly communicates at one end with a corresponding inlet manifold and at the other end with the two outlet manifolds located immediately adjacent that inlet manifold. The inlet manifolds are located distal from the heat-transfer surface. The interconnecting channels are configured such that substantially all of the heat collected by a working fluid is collected as the working fluid flows from the inlet manifolds toward the heat-transfer surface in a direction substantially perpendicular to the heat-transfer surface.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: August 30, 2005
    Assignee: Mikros Manufacturing, Inc.
    Inventor: Javier A. Valenzuela
  • Patent number: 6863117
    Abstract: A capillary evaporator (100) for removing heat from a heat source (102), particularly under high heat-flux conditions. The capillary evaporator includes a housing (104) having a plurality of ribs (108) in thermal communication with the heat source when the heat source is present. The ribs define a plurality of vapor channels (110) for receiving vapor (112) caused by the vaporization of working fluid (114) within the evaporator. A capillary wick (106) is located within the housing in spaced relation to the ribs. A bridge (118) interposed between the capillary wick and ribs thermally communicates heat from the ribs to the wick and fluidly communicates the vapor from the wick to the vapor channels. The bridge includes a plurality of fractal layers (FL) each having openings (122) and webs (128) that are scaled in size and number with respect to the immediately adjacent fractal layer and are arranged so that the openings in adjacent layers overlap one another.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: March 8, 2005
    Assignee: Mikros Manufacturing, Inc.
    Inventor: Javier A. Valenzuela