Patents by Inventor Javier A. Valenzuela
Javier A. Valenzuela has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230408545Abstract: The present disclosure relates to a heat exchanger for thermal control of heat producing devices. In accordance with aspects and embodiments, this is achieved in the present design by placing a parallel flow path near the heat sink in the test head with a variable restriction in each flow path. The restrictions may be operated in a complementary manner to keep the fluid inertia in the main supply and return lines substantially constant. This arrangement results in a test head with higher cooling capacity and quicker response time than achievable with prior art semiconductor testing systems. The test head includes a pair of nested pneumatic actuators having non-circular pistons designed to provide Z axis motion and roll and tilt compliance. The pneumatic actuator assembly may be mounted on segmented flexures to provide X axis, Y axis and yaw compliance.Type: ApplicationFiled: June 21, 2023Publication date: December 21, 2023Applicant: Mikros Manufacturing, Inc.Inventors: Jesse D. McGowan, Lucas H. Rose, Timothy F. Ryan, Adam E. Sharp, Javier A. Valenzuela
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Patent number: 11729945Abstract: An active device with a heat sink and low mechanical stress comprises a heat-producing substrate having a first thermal expansion coefficient; a heat sink having a second thermal expansion coefficient, wherein the first and second thermal expansion coefficients are different; and an interface between the heat-producing substrate and the heat sink formed so that, when the heat-producing substrate is operating at a predetermined temperature, a mechanical stress between the heat-producing substrate and the heat sink is substantially minimized. The heat sink has a yield strength that is lower than a yield strength of the heat-producing substrate and has been plastically deformed during fabrication to minimize the stress between the heat-producing substrate and the heat sink. Methods for fabricating the device are also disclosed.Type: GrantFiled: October 24, 2019Date of Patent: August 15, 2023Inventor: Javier A. Valenzuela
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Patent number: 11033038Abstract: Atmospheric control valve device, part of an atmospheric control system built into a refrigerated container, whose installation requires minimal intervention and is self-sufficient, compact and reusable due to its long, cylindrical body that includes a battery compartment. The body also has a compartment for the electrical, electronic and sensor elements; a handling compartment for the elements that handle the device; a cover area to cover the container after removing the device; and a gas exchange compartment for two-way gas exchanges, controlled by a solenoid valve and by the differences in pressure that occur naturally within the refrigerated container.Type: GrantFiled: July 18, 2016Date of Patent: June 15, 2021Assignee: Liventus S.A.Inventors: Claudia Alejandra Mardones Soto, Francisco Javier Valenzuela Rollán, Mariano Pola Matte
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Patent number: 10976101Abstract: A hatch device comprised by a main support body, a flow guide piece and an optional plug, which allows for minimum modifications in the service hatch cover's structure during installation.Type: GrantFiled: August 3, 2016Date of Patent: April 13, 2021Assignee: Liventus S.A.Inventors: Claudia Alejandra Mardones Soto, Francisco Javier Valenzuela Rollán, Mariano Pola Matte
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Publication number: 20200340739Abstract: A hatch device comprised by a main support body (3), a flow guide piece (24) and an optional plug (30), which allows for minimum modifications in the service hatch cover's (2) structure during installation, as shown in FIG. 7/9.Type: ApplicationFiled: August 3, 2016Publication date: October 29, 2020Applicant: Liventus S.A.Inventors: Claudia Alejandra MARDONES SOTO, Francisco Javier VALENZUELA ROLLÁN, Mariano POLA MATTE
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Publication number: 20200137924Abstract: An active device with a heat sink and low mechanical stress comprises a heat-producing substrate having a first thermal expansion coefficient; a heat sink having a second thermal expansion coefficient, wherein the first and second thermal expansion coefficients are different; and an interface between the heat-producing substrate and the heat sink formed so that, when the heat-producing substrate is operating at a predetermined temperature, a mechanical stress between the heat-producing substrate and the heat sink is substantially minimized. The heat sink has a yield strength that is lower than a yield strength of the heat-producing substrate and has been plastically deformed during fabrication to minimize the stress between the heat-producing substrate and the heat sink. Methods for fabricating the device are also disclosed.Type: ApplicationFiled: October 24, 2019Publication date: April 30, 2020Applicant: MIKROS TECHNOLOGIES LLCInventor: Javier A. Valenzuela
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Publication number: 20190098910Abstract: Atmospheric control valve device, part of an atmospheric control system built into a refrigerated container, whose installation requires minimal intervention and is self-sufficient, compact and reusable due to its long, cylindrical body that includes a battery compartment. The body also has a compartment for the electrical, electronic and sensor elements; a handling compartment for the elements that handle the device; a cover area to cover the container after removing the device; and a gas exchange compartment for two-way gas exchanges, controlled by a solenoid valve and by the differences in pressure that occur naturally within the refrigerated container.Type: ApplicationFiled: July 18, 2016Publication date: April 4, 2019Applicant: Liventus Chile S.A.Inventors: Claudia Alejandra Mardones Soto, Francisco Javier Valenzuela Rollán, Mariano Pola Matte
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Patent number: 8474516Abstract: A micro-channel heat exchanger suited for use in large-area cold plates includes a heat transfer member having winding micro-channels, a manifold, and a cover plate. The micro-channels' winding design is defined by a nonlinear flow axis that may include a plurality of short pitch and small amplitude undulations, which cause the flow to change directions, as well as two or more large amplitude bends that cause the flow to reverse direction. In low flow per unit area applications, the winding micro-channels allow a user to customize the pressure drop to promote good flow distribution, to achieve improved heat transfer uniformity, and to enable the pressure drop to remain above the bubble point of the heat transfer structure to prevent gas blockage. The winding micro-channels also improve the heat transfer coefficient.Type: GrantFiled: August 8, 2008Date of Patent: July 2, 2013Assignee: Mikros Manufacturing, Inc.Inventor: Javier A. Valenzuela
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Publication number: 20130056176Abstract: The heat exchanger with a controlled coefficient of thermal expansion (CTE) includes a low CTE thermal expansion control member operatively connected to a heat transfer member in order to restrain the lateral thermal expansion of the heat transfer member during use. The thermal expansion control member is placed outside the heat transfer path, so the thermal expansion control member can be made of a low thermal conductivity material without increasing the thermal resistance of the heat exchanger. The CTE of the thermal expansion control member is lower than that of the heat transfer member, so as to constrain lateral thermal expansion of the heat transfer member during operation. The difference between the CTE of the device being cooled and the heat transfer member, i.e. the CTE mismatch, is reduced over conventional heat exchangers by restraining the heat transfer member during operation.Type: ApplicationFiled: August 27, 2012Publication date: March 7, 2013Applicant: MIKROS MANUFACTURING, INC.Inventor: Javier A. Valenzuela
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Publication number: 20110226448Abstract: A winding channel heat exchanger includes a heat transfer member having winding channels, a manifold, and a cover plate. The channels' winding design is defined by a non-linear flow axis that may include a plurality of short pitch and small amplitude undulations, which cause the flow to change directions, and may also or alternatively include two or more large amplitude bends that cause the flow to reverse direction. In one embodiment, the undulations have varying amplitudes to increase the heat transfer coefficient along the length of the channel. The winding channels allow a user to customize the pressure drop to promote good flow distribution, to achieve improved heat transfer uniformity, and to improve the heat transfer coefficient.Type: ApplicationFiled: May 25, 2011Publication date: September 22, 2011Applicant: MIKROS MANUFACTURING, INC.Inventor: Javier A. Valenzuela
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Patent number: 7836943Abstract: A heat exchanger includes a heat transfer surface to transfer heat to or from a working fluid, a manifold region with a plurality of internal walls defining a plurality of inlet and outlet passages, and a heat transfer region disposed between the manifold region and the heat transfer surface. The internal walls are substantially normal to the heat transfer surface for directing working fluid in a normal direction, and include a plurality of alternating inflow and outflow portions in fluid communication with corresponding inlet passages and outlet passages. Adjacent inflow and outflow portions are in fluid communication with each other. A heat transfer structure is disposed in each of the plurality of inflow portions and extend between the internal walls of the inflow portion, the heat transfer structure being in thermal communication with the heat transfer surface to transfer heat between the working fluid and the heat transfer surface.Type: GrantFiled: November 12, 2007Date of Patent: November 23, 2010Assignee: Mikros Manufacturing, Inc.Inventor: Javier A. Valenzuela
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Patent number: 7775261Abstract: A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid-vapor manifold in fluid communication with a capillary structure thermally connected to a heat transfer interface, all of which are disposed in a housing to contain the vapor. The liquid-vapor manifold transports liquid in a first direction and conducts vapor in a second, opposite direction. The manifold provides a distributed supply of fluid (vapor or liquid) over the surface of the capillary structure. In one embodiment, the manifold has a fractal structure including one or more layers, each layer having one or more conduits for transporting liquid and one or more openings for conducting vapor. Adjacent layers have an increasing number of openings with decreasing area, and an increasing number of conduits with decreasing cross-sectional area, moving in a direction toward the capillary structure.Type: GrantFiled: March 8, 2005Date of Patent: August 17, 2010Assignee: Mikros Manufacturing, Inc.Inventor: Javier A. Valenzuela
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Publication number: 20100032147Abstract: A micro-channel heat exchanger suited for use in large-area cold plates includes a heat transfer member having winding micro-channels, a manifold, and a cover plate. The micro-channels' winding design is defined by a nonlinear flow axis that may include a plurality of short pitch and small amplitude undulations, which cause the flow to change directions, as well as two or more large amplitude bends that cause the flow to reverse direction. In low flow per unit area applications, the winding micro-channels allow a user to customize the pressure drop to promote good flow distribution, to achieve improved heat transfer uniformity, and to enable the pressure drop to remain above the bubble point of the heat transfer structure to prevent gas blockage. The winding micro-channels also improve the heat transfer coefficient.Type: ApplicationFiled: August 8, 2008Publication date: February 11, 2010Applicant: MIKROS MANUFACTURING, INC.Inventor: Javier A. Valenzuela
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Publication number: 20080066894Abstract: A normal-flow heat exchanger (NFHX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The NFHX comprises a core (130) having a heat-transfer surface (128), a length and a width. An inlet plenum (124) is located at one end of the length, and an outlet plenum (126) is located at the opposite end of the length. A plurality of inlet manifolds (140) extend the length of the core, and a plurality of outlet manifolds (142) extend the length of the core and are located alternatingly with the inlet manifolds across the width of the core. A plurality of interconnecting channels (144) each fluidly communicate with a corresponding inlet manifold and the two outlet manifolds located immediately adjacent that inlet manifold. A heat exchanger fin (154) is generally located between each pair of immediately adjacent interconnecting channels. In one embodiment, the core comprises a plurality of plate pairs (132) each comprising a heat exchanger plate (136) and a spacer plate (138).Type: ApplicationFiled: November 12, 2007Publication date: March 20, 2008Applicant: MIKROS MANUFACTURING, INC.Inventor: Javier Valenzuela
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Patent number: 7302998Abstract: A heat exchanger (120) includes a core (130) containing inlet manifold (140), outlet manifold (126), interconnecting channels (144) and a heat-transfer surface (128). Each interconnecting channel fluidly communicates at one end with a corresponding inlet manifold and at the other end with the two outlet manifolds located adjacent that inlet manifold. The inlet manifolds are located distal from the heat-transfer surface. The interconnecting channels are configured such that substantially all of the heat collected by a working fluid is collected as the working fluid flows from the inlet manifolds away from the heat-transfer surface in a direction substantially normal to the heat-transfer surface.Type: GrantFiled: August 30, 2005Date of Patent: December 4, 2007Assignee: Mikros Manufacturing, Inc.Inventor: Javier A. Valenzuela
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Patent number: 7278474Abstract: A heat exchanger (HX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The HX comprises a core (130) having a heat transfer surface (128), a length and a width. Inlet manifolds (140) and outlet manifolds (142) located alternatingly across the width of the core extend the length of the core. Interconnecting channels (144) each fluidly communicate with a corresponding outlet manifold and the two inlet manifolds located immediately adjacent that outlet manifold. Heat exchanger fin (154) in thermal communication with the heat transfer surface (128) generally defines the surface of the interconnecting channels. A pathway directs the working fluid first towards and then away from heat transfer surface (128) in a direction substantially normal to the heat transfer surface. Heat is transferred to or from the working fluid from heat transfer fin (154) as the fluid flows toward and away from the heat transfer surface.Type: GrantFiled: October 8, 2002Date of Patent: October 9, 2007Assignee: Mikros Manufacturing, Inc.Inventors: Javier A. Valenzuela, Thomas J. Jasinski
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Publication number: 20070017662Abstract: A heat-exchanger (HX) (120) utilizing a working fluid and having a high heat flux transfer capacity. The HX comprises a core (130) having a heat transfer surface (128), a length and a width. Inlet manifolds (140) and outlet manifolds (142) located alternatingly across the width of the core extend the length of the core. Interconnecting channels (144) each fluidly communicate with a corresponding outlet manifold and the two inlet manifolds located immediately adjacent that outlet manifold. Heat exchanger fin (154) in thermal communication with the heat transfer surface (128) generally defines the surface of the interconnecting channels. A pathway directs the working fluid first towards and then away from heat transfer surface (128) in a direction substantially normal to the heat transfer surface. Heat is transferred to or from the working fluid from heat transfer fin (154) as the fluid flows toward and away from the heat transfer surface.Type: ApplicationFiled: August 30, 2005Publication date: January 25, 2007Applicant: Mikros Manufacturing, Inc.Inventor: Javier Valenzuela
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Publication number: 20050230085Abstract: A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid-vapor manifold in fluid communication with a capillary structure thermally connected to a heat transfer interface, all of which are disposed in a housing to contain the vapor. The liquid-vapor manifold transports liquid in a first direction and conducts vapor in a second, opposite direction. The manifold provides a distributed supply of fluid (vapor or liquid) over the surface of the capillary structure. In one embodiment, the manifold has a fractal structure including one or more layers, each layer having one or more conduits for transporting liquid and one or more openings for conducting vapor. Adjacent layers have an increasing number of openings with decreasing area, and an increasing number of conduits with decreasing cross-sectional area, moving in a direction toward the capillary structure.Type: ApplicationFiled: March 8, 2005Publication date: October 20, 2005Inventor: Javier Valenzuela
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Patent number: 6935411Abstract: A heat exchanger (120) comprising a core (130) containing inlet manifolds (140), outlet manifold (126) and interconnecting channels (144) and having a heat-transfer surface (128). Each interconnecting channel fluidly communicates at one end with a corresponding inlet manifold and at the other end with the two outlet manifolds located immediately adjacent that inlet manifold. The inlet manifolds are located distal from the heat-transfer surface. The interconnecting channels are configured such that substantially all of the heat collected by a working fluid is collected as the working fluid flows from the inlet manifolds toward the heat-transfer surface in a direction substantially perpendicular to the heat-transfer surface.Type: GrantFiled: June 8, 2001Date of Patent: August 30, 2005Assignee: Mikros Manufacturing, Inc.Inventor: Javier A. Valenzuela
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Patent number: 6863117Abstract: A capillary evaporator (100) for removing heat from a heat source (102), particularly under high heat-flux conditions. The capillary evaporator includes a housing (104) having a plurality of ribs (108) in thermal communication with the heat source when the heat source is present. The ribs define a plurality of vapor channels (110) for receiving vapor (112) caused by the vaporization of working fluid (114) within the evaporator. A capillary wick (106) is located within the housing in spaced relation to the ribs. A bridge (118) interposed between the capillary wick and ribs thermally communicates heat from the ribs to the wick and fluidly communicates the vapor from the wick to the vapor channels. The bridge includes a plurality of fractal layers (FL) each having openings (122) and webs (128) that are scaled in size and number with respect to the immediately adjacent fractal layer and are arranged so that the openings in adjacent layers overlap one another.Type: GrantFiled: February 26, 2003Date of Patent: March 8, 2005Assignee: Mikros Manufacturing, Inc.Inventor: Javier A. Valenzuela