Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Abstract: An apparatus is described. The apparatus includes a particle collector to collect particles from an electrically insulating liquid that one or more electronic devices are to be immersed within. The particle collector having an input port to receive the electrically insulating liquid. The particle collector having an output port to emit the electrically insulating liquid. The particle collector having one or more phoretic force devices. The phoretic force devices to induce phoretic forces within the particle collector that cause the particles to collect within the particle collector. A structure is also described. The structure is to be immersed in electrically insulating liquid and mimic a boiling enhancement layer of a cooling assembly of a chip package disposed on an electronic circuit board that is also immersed in the electrically insulating liquid.

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

Abstract: A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.

Abstract: A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.

Abstract: Apparatuses and systems associated with anti-recirculation devices for fan-implemented coolant systems are disclosed herein. In embodiments, an apparatus for server computing may include a housing to be affixed adjacent to a fan associated with providing a flow of air to a compute, storage or network node. The housing may be in line with the flow of air, and may have an arrangement of apertures formed in a side of the housing. The apparatus may further include a gate rotatably coupled to the housing. The gate may include a door to rotate to cover the arrangement of apertures based on a lack of air being blown by the fan to prevent a back flow of air through the fan. Other embodiments may be described and/or claimed.