Abstract: A field-sensor device comprises a first field sensor with a first sensor response to a field. The first sensor response is measured in a first orientation to produce a first sensor signal, a second field sensor with a second sensor response to the field the second sensor response measured in a second orientation different from the first orientation to produce a second sensor signal, and a controller for controlling the first and second field sensors to produce respective first and second sensor signals. The controller comprises a control circuit that converts any combination of first and second sensor signals to equivalent first and second comparable sensor signals in a common orientation, calculates an error signal derived from differences between the first and second comparable sensor signals, and adjusts any combination of the first and second sensor responses to reduce the error signal.

Abstract: The present invention relates to a current-sensor structure comprising a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction and optionally parallel to a conductor surface. The current-sensor structure can comprise a substrate on which the conductor is disposed. The current sensor can be located on a side of the conductor opposite or orthogonal to a surface of the substrate. The current sensor can be aligned with, near to or adjacent to an edge of the conductor. The current-sensor structure can comprise a shield, such as a U-shaped laminated shield that at least partially surrounds the conductor and the current sensor.

Abstract: A current-sensor structure comprises a conductor for conducting electrical current in a current direction. The conductor has one or more conductor surfaces and an edge. At least one current sensor is disposed on, over, adjacent to or in contact with the conductor and is offset from a centre of the conductor in an offset direction orthogonal to the current direction. The current sensor is aligned with the edge of the conductor or the conductor has a width W and the current sensor is within a distance of W/2.5, W/3, W/4, W/5 or W/6 of the conductor edge. The current-sensor structure can comprise a substrate on which the conductor is disposed.

Abstract: The present invention relates to a sensor device comprising four or more sensor elements. A controller comprising a control circuit controls the sensor elements to measure an environment attribute, produces more than two values corresponding to the measurement and compares the values to determine a fault. The more than two values are obtained by different combinations of sensor elements that have at least one sensor element in common and one sensor element that is not in common. The values can be measured in different coordinate systems and the control circuit can convert the field vectors into a common coordinate system.

Abstract: A magnetic sensor device comprises a substrate having a surface and a magnetic sensor. A plurality of magnetic cores is disposed on, over, below or in direct contact with a substrate surface, at least one of the magnetic cores having an electrical conductor helically wound around the core forming a coil having a coil length. Each magnetic core is separated from any other magnetic core by a gap length. A current passing through the one or more coils generates a magnetic field. The plurality of cores and gaps form at least one closed magnetic circuit along which the generated magnetic field flux passes, and the total length of the at least one closed magnetic circuit is at least twice the total length of the plurality of gaps of the at least one closed magnetic circuit through which the at least a portion of the magnetic field flux passes.

Abstract: A magnetic field sensor is described comprising at least three magnetic flux concentrator sections integrated on a planar substrate, each section being adjacent to at least one of the other sections and being separated by gaps. The sensor comprises at least a first sensing element positioned for sensing flux density in or near the gap between a first section and a second section and at least a second sensing element positioned for sensing flux density in or near the gap between the first section and at least a further section. The magnetic field sensor further comprises further sensing elements arranged to measure changes of the magnetic field in the direction perpendicular to the substrate.

Abstract: A magnetic sensor device comprises a substrate, first and second magnetic sensors, and one or more inductors are disposed over the substrate and are controlled by a magnetic sensor controller having a control circuit. The control circuit controls the first magnetic sensor to measure a first magnetic field and the second magnetic sensor to measure a second magnetic field under presence of a fifth magnetic field generated by the inductors. The control circuit controls the first magnetic sensor to measure a third magnetic field and the second magnetic sensor to measure a fourth magnetic field under presence of a sixth magnetic field generated by the inductors, the fifth magnetic field and the sixth magnetic field being different. The control circuit calculates a relative sensitivity matching value converting magnetic field values measured by the second magnetic sensor to a comparable magnetic field value measured by the first magnetic sensor.

Abstract: A field-sensor device comprises first and second field sensors disposed in corresponding different first and second orientations, each responsive to an external field to produce corresponding first and second sensor signals. One of or both the first and second sensor signals are converted to equivalent comparable sensor signals in a common orientation and compared to determine a faulty field sensor. If a faulty field sensor is determined, a faulty sensor signal is produced or, if a faulty sensor is not determined, an output sensor signal responsive to the first, second or comparable sensor signals is produced. Evaluation of the direction of differences between the comparable sensor signals can determine which of the first and second field sensors is faulty.

Abstract: A method for detecting an error in a bridge sensor which is adapted for measuring a physical parameter. The method comprises biasing a first contact pair of the bridge sensor at least two times in a first direction and at least one time in a second direction opposite to the first direction; while biasing the first contact pair, measuring an output signal on a different contact pair of the bridge sensor, thus obtaining at least three output measurements which are representative for the physical parameter and which are separated by time intervals; combining the output measurements to obtain an output value which is indicative for an error in the bridge sensor, wherein the output measurements which are combined are only those output measurements which are measured when biasing the first contact pair.

Abstract: An integrated circuit for error detection comprises an input for receiving two signals, in which a first signal is representative of a physical quantity in a first range and a second signal is representative of the physical quantity in a second range. The first range and second range are different ranges that overlap. The circuit comprises a processor configured to detect an inconsistency between the two signals by taking said first and second range into account, in which this inconsistency is indicative of an error.

Abstract: A method for detecting a fault in a sensor arrangement is described. The method comprising modulating at least one physical parameter of the sensor arrangement by a configuration value, wherein the at least one physical parameter of the sensor arrangement is modulated during operation of the sensor arrangement, comparing an output of the sensor arrangement with a reference output related to the modulated at least one physical parameter and detecting a fault based on the comparison. Furthermore, also a corresponding processing circuit is described.

Abstract: A method of determining a position of a sensor device relative to an external magnetic field, comprises: providing currents to conductors to generate an internal magnetic field that will superimpose with the external magnetic field, measuring field components of the combined magnetic field, calculating a position based on the applied currents and/or on the measured residual magnetic field. A position sensor is provided for performing the method.

Abstract: A multi-element sensor includes a substrate having a surface. A first sensing element for sensing an environmental attribute is disposed on or over the substrate surface. A second sensing element is disposed over the same substrate surface as the first sensing element, above the first sensing element in a direction orthogonal to the substrate surface. The second sensing element is arranged for sensing the same environmental attribute. In one configuration, the first and second sensing elements sense the same environmental attribute at a location between the first and second sensing elements.

Abstract: A semiconductor device comprising a passive magnetoelectric transducer structure adapted for generating a charge via mechanical stress caused by a magnetic field. The first transducer structure has a first terminal electrically connectable to the control terminal of an electrical switch, and having a second terminal electrically connectable to the first terminal of the electrical switch for providing a control signal for opening/closing the switch. The switch may be a FET. A passive magnetic switch using a magnetoelectric transducer structure. Use of a passive magnetoelectric transducer structure for opening or closing a switch without the need for an external power supply.

Abstract: An integrated circuit package comprises a lead frame including a plurality of leads and a current conductor forming an electrically conductive path that connects at least two leads of the plurality of leads. The package also comprises a semiconductor die comprising an integrated circuit and having first and second opposing surfaces, the first surface being proximate to the current conductor. Each of the at least two leads comprises a groove to locally space the lead away from the semiconductor die in a direction perpendicular to the first surface, in which the groove comprises at least that part of the lead that overlaps the edge of the semiconductor die.