Abstract: A light-field optical image system with dual mode, having a main lens (103), a microlens array (102), an image sensor (101) and a first actuator (201) configured to cause a relative displacement between the image sensor (101) and the microlens array (102) to switch between at least two different optical configurations including: a light-field configuration, in which the image sensor (101) and the microlens array (102) are separated by a first distance (107a) that allows the image sensor (101) to capture a light-field image; and a 2D imaging configuration, in which the image sensor (101) and the microlens array (102) are separated by a second distance (107b), lower than the first distance (107a), that allows the image sensor (101) to avoid the light-field effect.

Abstract: An optical system (400) including a microlens array (104), an image sensor (108) and a PCB (206). The microlens array (104) is bonded to the image sensor (108) with glue lines (804) or glue drops (802) dispensed around the non-active area (404) of the microlens array (104). The image sensor (108) may be bonded to the PCB (206) with a layer of adhesive material (502) applied only on a central region of the image sensor (108). Alternatively, the image sensor can rest onto a thermally conductive resin layer (109) placed over a stiffener (207), and the image sensor can be attached to the PCB (206) by one or more glue drops (111) or glue lines (113) arranged on at least one side of the image sensor (108) or by an adhesive layer (115) laterally surrounding the image sensor (108). The optical system (400) solves the problem of misalignment between the image sensor and the microlens array caused by changes in temperature.

Abstract: An optical system (400) including a microlens array (104), an image sensor (108) and aPCB (206). The microlens array (104) is bonded to the image sensor (108) with glue lines (804) or glue drops (802) dispensed around the non-active area (404) of the microlens array (104). The image sensor (108) may be bonded to the PCB (206) with a layer of adhesive material (502) applied only on a central region of the image sensor (108). Alternatively, the image sensor can rest onto a thermally conductive resin layer (109) placed over a stiffener (207), and the image sensor can be attached to the PCB (206) by one or more glue drops (111) or glue lines (113) arranged on at least one side of the image sensor (108) or by an adhesive layer (115) laterally surrounding the image sensor (108). The optical system (400) solves the problem of misalignment between the image sensor and the microlens array caused by changes in temperature.

Abstract: A pillar assembly for a vehicle can include a substrate, a transparent layer, and a transparent flexible film layer sealed between the substrate and the transparent layer. The film layer can have disposed thereon or attached thereto an opaque material defining apertures corresponding to displayable elements, a capacitive-sensing layer, a plurality of light emitting devices disposed proximate to the apertures, and wiring connected to the plurality of light emitting devices and the capacitive-sensing layer, the wiring being configured to connect to control circuitry. A method of manufacturing a pillar assembly can utilize two separate film layers with a transparent or translucent polymer injected therebetween and a transparent material, such as polyurethane, flooded over an outer surface.