Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: In one embodiment, the present invention includes a semiconductor package having a plurality of fan blades embedded within a first surface of the package, where a first group of the fan blades extend from a first side of the package and a second group of the fan blades extend from a second side of semiconductor package. The fan blades may be powered by piezoelectric devices to cause motion of the fan blades. Other embodiments are described and claimed.

Abstract: A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.

Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: Methods and apparatus relating to use and/or provision of a rake piezo actuator are described. In one embodiment, a piezo patch may be coupled to a plurality of blades (e.g., to cause the blades to oscillate and provide air flow between fins of one or more heat sinks). Other embodiments are also described.

Abstract: A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method to couple a module to a board including power circuitry. The method includes detecting a module's power requirements before providing payload power to the module and routing a regulated power level to the module via at least one power feed based on the detected power requirements. The regulated power is provided by the board's power circuitry.

Abstract: A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.

Abstract: Methods and apparatus relating to use and/or provision of a rake piezo actuator are described. In one embodiment, a piezo patch may be coupled to a plurality of blades (e.g., to cause the blades to oscillate and provide air flow between fins of one or more heat sinks). Other embodiments are also described.

Abstract: In one embodiment, the present invention includes a system including a processor to access a maximum memory space of a first size using a memory address having a first length, a chipset coupled to the processor to interface the processor to a memory including a physical memory space, where the chipset is to access a maximum memory space larger than the first maximum memory space, and a virtual machine monitor (VMM) to enable the processor to access the full physical memory space of a memory. Other embodiments are described and claimed.

Abstract: A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.

Abstract: In one embodiment, the present invention includes a semiconductor package having a plurality of fan blades embedded within a first surface of the package, where a first group of the fan blades extend from a first side of the package and a second group of the fan blades extend from a second side of semiconductor package. The fan blades may be powered by piezoelectric devices to cause motion of the fan blades. Other embodiments are described and claimed.

Abstract: The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger. The specification also discloses a process comprising cooling a heat source using a closed-loop cooling system comprising a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger, and removing or installing the pump module while the cooling system is operating.

Abstract: A configurable multi-faceted input/output (I/O) panel may be used in a computer or electronic device to present multiple I/O interfaces to a user. The configurable multi-faceted I/O panels may be configured by a user such that one of a plurality of different I/O faces is accessible to the user. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A thermoelectric module having areas of highly thermally conductive material integrated into a substrate layer. For one embodiment copper pads are integrated into the external surface of the substrate of the hot side of the thermoelectric module. The copper pads allow direct connection of a heat removal device to the thermoelectric module thereby reducing thermal resistance. Thermal vias may be formed through the substrate to further reduce thermal resistance.

Abstract: One or more components on one or more circuit boards in a chassis may be configured and/or oriented such that the component(s) are aligned with a diagonal predominant air flow path through the chassis. In one embodiment, components may be mounted on a circuit board with a skewed orientation that aligns the components with the predominant air flow path. In another embodiment, one or more heat sinks may include angled fins that are aligned with the predominant air flow path. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A reconfigurable airflow director for modular blade chassis. The airflow director includes multiple duct channels having adjustable inlets and/or outlets. The airflow director may be reconfigured to adjust the amount of airflow across selected blades and selected zones on an individual blade. In one embodiment, snap-in airflow blockers are employed to block all or a portion of selected inlets or outlets to adjust the airflow through corresponding duct channels. In one embodiment, adjustable inlet vanes are employed to increase or decrease the size of adjacent inlets. In one embodiment, the airflow director is formed from multiple airflow director modules, each including an outer shell having multiple ribs extending therefrom to form multiple airflow channels, wherein the airflow director modules are stacked together to form a plurality of duct channels. Modular fan assemblies including multiple hot-swappable fans are employed to push and/or draw airflow through the duct channels of the airflow director.