Patents by Inventor Javier Resendez

Javier Resendez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9985367
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: May 29, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20180109037
    Abstract: A wafer connector is disclosed in which a plurality of twin-axial wires are terminated to the tails of ground and signal terminals of the connector. Each twin-axial wire includes a pair of signal wires enclosed in a conductive sheath. A conductive grounding clamp is provided that contacts the sheaths of the twin-axial wires and holds them together as a unit to facilitate the attachment of the wires to the connector terminal tails. The clamp has two opposing halves that cooperatively define openings which receive the twin-axial wires and flat, interconnecting portions extending between the openings that provide contact points where the grounding clamp may be attached to the connector terminal tails.
    Type: Application
    Filed: December 19, 2017
    Publication date: April 19, 2018
    Applicant: Molex, LLC
    Inventors: Javier RESENDEZ, Michael ROST, Christopher WANHA, Frank KEYSER
  • Publication number: 20180040982
    Abstract: A cable connector assembly includes a first connector configured to mate with a second connector. The first connector has a first housing that supports a wafer with a first mating portion defined by the first housing and the wafer. The first connector includes a cable connected to the wafer that is disposed in a first housing. The first connector also includes a second housing with a latch and the second housing is movably mounted to the first housing. A biasing element disposed between the first housing and the second housing acts to urge the first housing and the second housing apart.
    Type: Application
    Filed: February 10, 2016
    Publication date: February 8, 2018
    Applicant: Molex, LLC
    Inventors: Javier Resendez, Kenneth Janota
  • Publication number: 20180034175
    Abstract: A wire to board connector is provided for connecting cables of cable bypass assemblies to circuitry mounted on a circuit board. The connector has a structure that maintains the geometry of the cable through the connector. The connector includes a pair of edge coupled conductive signal terminals and a ground shield to which the signal terminals are broadside coupled. The connector includes a pair of ground terminals aligned with the signal terminals and both sets of terminals have J-shaped contact portions that flex linearly when the connector is inserted into a receptacle. In another embodiment, the signal terminal contact portions are supported by a compliant member that may deflect when the connectors engage contact pads on a substrate.
    Type: Application
    Filed: January 11, 2016
    Publication date: February 1, 2018
    Applicant: Molex, LLC
    Inventors: Brian Keith LLOYD, Gregory B. WALZ, Bruce REED, Gregory FITZGERALD, Ayman ISAAC, Kent E. REGNIER, Brandon JANOWIAK, Darian R. SCHULZ, Munawar AHMAD, Eran J. JONES, Javier RESENDEZ, Michael ROST
  • Patent number: 9882325
    Abstract: A cable tray assembly includes a first shell that defines a hollow interior and a second shell that defines a hollow interior, wherein one of the shells is partially inserted into the other shell so that the two hollow interiors are in communication. The shells each include a face that is opposite the face on the other shell and the faces support a plurality of connectors. An adjustment system helps control the distance between the two faces so that the cable tray can connect two row of connectors that are a distance apart where the distance is variable.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: January 30, 2018
    Assignee: Molex, LLC
    Inventors: Tommy Lawrence, Javier Resendez, Takayuki Arai
  • Patent number: 9865977
    Abstract: Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires can be terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: January 9, 2018
    Assignee: Molex, LLC
    Inventors: Javier Resendez, Michael D. Rost, Eric A. Deichmann, Kenneth F. Janota
  • Publication number: 20180006416
    Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.
    Type: Application
    Filed: January 11, 2016
    Publication date: January 4, 2018
    Applicant: Molex, LLC
    Inventors: Brian Keith LLOYD, Gregory B. WALZ, Bruce REED, Gregory FITZGERALD, Ayman ISAAC, Kent E. REGNIER, Bradon JANOWIAK, Darian R. SCHULZ, Munawar AHMAD, Eran J. JONES, Javier RESENDEZ, Michael ROST
  • Patent number: 9859659
    Abstract: A wafer connector is disclosed in which a plurality of twin-axial wires are terminated to the tails of ground and signal terminals of the connector. Each twin-axial wire includes a pair of signal wires enclosed in a conductive sheath. A conductive grounding clamp is provided that contacts the sheaths of the twin-axial wires and holds them together as a unit to facilitate the attachment of the wires to the connector terminal tails. The clamp has two opposing halves that cooperatively define openings which receive the twin-axial wires and flat, interconnecting portions extending between the openings that provide contact points where the grounding clamp may be attached to the connector terminal tails.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: January 2, 2018
    Assignee: Molex, LLC
    Inventors: Javier Resendez, Michael Rost, Christopher Wanha, Frank Keyser
  • Publication number: 20170365943
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: August 11, 2017
    Publication date: December 21, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170302011
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: July 5, 2017
    Publication date: October 19, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20170288354
    Abstract: A cable tray assembly includes a first shell that defines a hollow interior and a second shell that defines a hollow interior, wherein one of the shells is partially inserted into the other shell so that the two hollow interiors are in communication. The shells each include a face that is opposite the face on the other shell and the faces support a plurality of connectors. An adjustment system helps control the distance between the two faces so that the cable tray can connect two row of connectors that are a distance apart where the distance is variable.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Applicant: Molex, LLC
    Inventors: Tommy Lawrence, Javier Resendez, Takayuki Arai
  • Publication number: 20170162960
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: February 15, 2017
    Publication date: June 8, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9608348
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: March 28, 2017
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170033478
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Application
    Filed: October 11, 2016
    Publication date: February 2, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20170005445
    Abstract: Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires can be terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.
    Type: Application
    Filed: September 19, 2016
    Publication date: January 5, 2017
    Applicant: Molex, LLC
    Inventors: Javier Resendez, Michael D. Rost, Eric A. Deichmann, Kenneth F. Janota
  • Patent number: 9490558
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 8, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 9455534
    Abstract: Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires are terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: September 27, 2016
    Assignee: Molex, LLC
    Inventors: Javier Resendez, Michael D. Rost, Eric A. Deichmann, Kenneth F. Janota
  • Publication number: 20160268714
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Application
    Filed: May 23, 2016
    Publication date: September 15, 2016
    Applicant: Molex, LLC
    Inventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20160164227
    Abstract: A wafer connector is disclosed in which a plurality of twin-axial wires are terminated to the tails of ground and signal terminals of the connector. Each twin-axial wire includes a pair of signal wires enclosed in a conductive sheath. A conductive grounding clamp is provided that contacts the sheaths of the twin-axial wires and holds them together as a unit to facilitate the attachment of the wires to the connector terminal tails. The clamp has two opposing halves that cooperatively define openings which receive the twin-axial wires and flat, interconnecting portions extending between the openings that provide contact points where the grounding clamp may be attached to the connector terminal tails.
    Type: Application
    Filed: July 9, 2014
    Publication date: June 9, 2016
    Applicant: Molex, LLC
    Inventors: Javier RESENDEZ, Michael ROST, Christopher WANHA, Frank KEYSER
  • Patent number: 9362678
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 7, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost