Patents by Inventor Javier S. Gonzalez

Javier S. Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming die backside coating structures with coreless packages
    Patent number: 8466559
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: June 18, 2013
    Assignee: Intel Corporation
    Inventors: Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier S. Gonzalez, Edward R. Prack
  • FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
    Publication number: 20120153494
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Inventors: Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier S. Gonzalez, Edward R. Prack