Patents by Inventor Javier S. Gonzalez

Javier S. Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Registration of LOI fiducials with camera
    Patent number: 11963909
    Abstract: A method and surgical system including a laser source for generating a pulsed laser beam, an imaging system including a detector, shared optics configured for directing the pulsed laser beam to an object to be sampled and confocally deflecting back-reflected light from the object to the detector, a patient interface, through which the pulsed laser beam is directed, the patient interface having, a cup with a large and small opening, and a notched ring inside the cup; and a controller operatively coupled to the laser source, the imaging system and the shared optics, the controller configured to align the eye for procedure.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: April 23, 2024
    Assignee: AMO Development, LLC
    Inventors: John S. Hart, David A. Dewey, Georg Schuele, Phillip H. Gooding, Christine J. Beltran, Javier G. Gonzalez, Katrina B. Sheehy, Jeffrey A. Golda, Raymond Woo, Madeleine C. O'Meara, Noah Bareket, Thomas Z. Teisseyre, Bruce Woodley
  • Forming die backside coating structures with coreless packages
    Patent number: 8466559
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: June 18, 2013
    Assignee: Intel Corporation
    Inventors: Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier S. Gonzalez, Edward R. Prack
  • FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
    Publication number: 20120153494
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Inventors: Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier S. Gonzalez, Edward R. Prack