Patents by Inventor Javier S. Gonzalez

Javier S. Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240366085
    Abstract: A laser surgery system includes a light source, an eye interface device, a scanning assembly, a confocal detection assembly and preferably a confocal bypass assembly. The light source generates an electromagnetic beam. The scanning assembly scans a focal point of the electromagnetic beam to different locations within the eye. An optical path propagates the electromagnetic beam from a light source to the focal point, and also propagates a portion of the electromagnetic beam reflected from the focal point location back along at least a portion of the optical path. The optical path includes an optical element associated with a confocal detection assembly that diverts a portion of the reflected electromagnetic radiation to a sensor. The sensor generates an intensity signal indicative of intensity the electromagnetic beam reflected from the focal point location. The confocal bypass assembly reversibly diverts the electromagnetic beam along a diversion optical path around the optical element.
    Type: Application
    Filed: July 12, 2024
    Publication date: November 7, 2024
    Inventors: Georg Schuele, Noah Bareket, David Dewey, John S. Hart, Javier G. Gonzalez, Raymond Woo, Thomas Z. Teisseyre, Jeffrey A. Golda, Katrina B. Sheehy, Madeleine C. O'Meara, Bruce Woodley
  • Patent number: 12068172
    Abstract: Embodiments disclosed herein include electronic packages and methods of making electronic packages. In an embodiment, the electronic package comprises a package substrate, an array of first level interconnect (FLI) bumps on the package substrate, wherein each FLI bump comprises a surface finish, a first pad on the package substrate, wherein the first pad comprises the surface finish, and wherein a first FLI bump of the array of FLI bumps is electrically coupled to the first pad, and a second pad on the package substrate, wherein the second pad is electrically coupled to the first pad.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: August 20, 2024
    Assignee: Intel Corporation
    Inventors: Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun K. Jen, Steve S. Cho, Jason M. Gamba, Javier Soto Gonzalez
  • Patent number: 12042228
    Abstract: A laser surgery system includes a light source, an eye interface device, a scanning assembly, a confocal detection assembly and preferably a confocal bypass assembly. The light source generates an electromagnetic beam. The scanning assembly scans a focal point of the electromagnetic beam to different locations within the eye. An optical path propagates the electromagnetic beam from a light source to the focal point, and also propagates a portion of the electromagnetic beam reflected from the focal point location back along at least a portion of the optical path. The optical path includes an optical element associated with a confocal detection assembly that diverts a portion of the reflected electromagnetic radiation to a sensor. The sensor generates an intensity signal indicative of intensity the electromagnetic beam reflected from the focal point location. The confocal bypass assembly reversibly diverts the electromagnetic beam along a diversion optical path around the optical element.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: July 23, 2024
    Assignee: AMO Development, LLC
    Inventors: Georg Schuele, Noah Bareket, David Dewey, John S. Hart, Javier G. Gonzalez, Raymond Woo, Thomas Z. Teisseyre, Jeffrey A. Golda, Katrina B. Sheehy, Madeleine C O'Meara, Bruce Woodley
  • Patent number: 8466559
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: June 18, 2013
    Assignee: Intel Corporation
    Inventors: Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier S. Gonzalez, Edward R. Prack
  • Publication number: 20120153494
    Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Inventors: Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Javier S. Gonzalez, Edward R. Prack