Patents by Inventor Javvad Qasimi
Javvad Qasimi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9548170Abstract: A guard assembly is for an electrical switching apparatus of an electrical system. The electrical system includes a number of conductors each having an insulated portion and an exposed portion that meet at a junction. The electrical switching apparatus includes a housing and a number of terminals connected to the exposed portion of a conductor. The guard assembly comprises: an interconnect member coupled to the housing; and a number of guard members each comprising: a first portion coupled to the interconnect member, and a second portion extending from the first portion away from the housing, the second portion comprising: a first distal end located at the first portion, and a second distal end opposite and distal from the first distal end. Each of the guard members has an opening. The opening receives a conductor. Each junction is located between a second distal end and a terminal.Type: GrantFiled: April 30, 2015Date of Patent: January 17, 2017Assignee: EATON CORPORATIONInventors: William Michael Crooks, Charles Bradley Anderson, Michael Paul Puskar, David Michael Olszewski, Javvad Qasimi
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Publication number: 20160211093Abstract: A guard assembly is for an electrical switching apparatus of an electrical system. The electrical system includes a number of conductors each having an insulated portion and an exposed portion that meet at a junction. The electrical switching apparatus includes a housing and a number of terminals connected to the exposed portion of a conductor. The guard assembly comprises: an interconnect member coupled to the housing; and a number of guard members each comprising: a first portion coupled to the interconnect member, and a second portion extending from the first portion away from the housing, the second portion comprising: a first distal end located at the first portion, and a second distal end opposite and distal from the first distal end. Each of the guard members has an opening. The opening receives a conductor. Each junction is located between a second distal end and a terminal.Type: ApplicationFiled: April 30, 2015Publication date: July 21, 2016Applicant: EATON CORPORATIONInventors: William Michael Crooks, Charles Bradley Anderson, Michael Paul Puskar, David Michael Olszewski, Javvad Qasimi
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Patent number: 9003877Abstract: A flow sensor assembly that may include features that help prevent moisture from reaching a sensor die of the flow sensor assembly. In some cases, such features may include a bypass channel that is configured to reverse the direction of the flow of fluid at least once upstream of the sensor die. In some cases, an encapsulant may cover one or more bond pads of the sensor die. In some cases, an output of the flow sensor assembly may be a raw sensor output signal produced by the one or more sensor elements of the sensor die, without significant processing of the raw sensor signal.Type: GrantFiled: November 16, 2012Date of Patent: April 14, 2015Assignee: Honeywell International Inc.Inventors: Mohammed Abdul Javvad Qasimi, Josh M. Fribley, Andrew J. Milley
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Patent number: 8986180Abstract: Disclosed is a portable perturbation device and methods for proprioceptive and reactive balance training and therapy. The perturbation device is manipulated by a user, person other than the user, or mechanical device to impart linear, rotational or tilting movement, or a combination thereof. The device generally comprises a base, a movable assembly positioned on the based and configured to be stood upon by a user. The movable assembly is movable with respect to the base by a manually manipulated assembly connected to the movable assembly. Manipulation of the device may create linear, rotational, or tilting movement, or a combination thereof.Type: GrantFiled: April 14, 2012Date of Patent: March 24, 2015Assignee: Balance Dynamix, LLCInventors: Jeffrey A. VanBuren, Javvad Qasimi, Chris Relyea
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Patent number: 8757001Abstract: A force sensor system includes a substrate, a cover, a sensor, and a spherical force transfer element. The cover is coupled to the substrate, and has an inner surface, an outer surface, an opening extending between the inner and outer surfaces, and a wall structure extending from the inner surface that defines a sensor cavity between the inner surface and the substrate. The sensor is mounted on the substrate, is disposed within the sensor cavity, and is configured to generate a sensor signal representative of a force supplied to the sensor. The spherical force transfer element is disposed partially within the sensor cavity, is movable relative to the cover, extends from the opening in the cover, and engages the sensor. The spherical force transfer element is adapted to receive an input force and is configured, upon receipt of the input force, to transfer the input force to the sensor.Type: GrantFiled: September 27, 2012Date of Patent: June 24, 2014Assignee: Honeywell International Inc.Inventors: Richard Wade, Ian Bentley, Mohammed Abdul Javvad Qasimi
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Publication number: 20140083209Abstract: A force sensor system includes a substrate, a cover, a sensor, and a spherical force transfer element. The cover is coupled to the substrate, and has an inner surface, an outer surface, an opening extending between the inner and outer surfaces, and a wall structure extending from the inner surface that defines a sensor cavity between the inner surface and the substrate. The sensor is mounted on the substrate, is disposed within the sensor cavity, and is configured to generate a sensor signal representative of a force supplied to the sensor. The spherical force transfer element is disposed partially within the sensor cavity, is movable relative to the cover, extends from the opening in the cover, and engages the sensor. The spherical force transfer element is adapted to receive an input force and is configured, upon receipt of the input force, to transfer the input force to the sensor.Type: ApplicationFiled: September 27, 2012Publication date: March 27, 2014Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Richard Wade, Ian Bentley, Mohammed Abdul Javvad Qasimi
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Patent number: 8656772Abstract: This disclosure relates generally to flow sensors, and more particularly, to flow sensors that include a pressure related output signal. In one example, a flow sensor assembly may include a housing with an inlet flow port, an outlet flow port and a fluid channel extending therebetween, with a flow sensing element positioned in the housing and exposed to the fluid channel. A filter insert may be situated in the fluid channel, sometimes upstream of the flow sensor. When so configured, the flow sensor assembly may output a pressure or differential pressure based, at least in part, on a value of the flow rate through the fluid channel as sensed by the flow sensor.Type: GrantFiled: October 14, 2011Date of Patent: February 25, 2014Assignee: Honeywell International Inc.Inventors: Mohammed Abdul Javvad Qasimi, William Hoover, Richard Charles Sorenson, Craig Scott Becke
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Patent number: 8640552Abstract: A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.Type: GrantFiled: September 6, 2011Date of Patent: February 4, 2014Assignee: Honeywell International Inc.Inventors: Mohammed Abdul Javvad Qasimi, Lamar Floyd Ricks
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Patent number: 8424380Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.Type: GrantFiled: March 29, 2012Date of Patent: April 23, 2013Assignee: Honeywell International Inc.Inventors: Scott E Beck, Paul P Bey, Jamie Speldrich, Mohammed A. Javvad Qasimi
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Patent number: 8397586Abstract: The present disclosure relates generally to flow sensors, and more particularly, to methods and devices for reducing variations in fluid flow across the flow sensor for increased accuracy and/or reliability. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port and an outlet flow port. The housing defines a fluid channel extending between the inlet flow port and the outlet flow port, with a flow sensor positioned in the housing and exposed to the fluid channel. The flow sensor is configured to sense a measure related to the flow rate of a fluid flowing through the fluid channel. A porous insert is situated in the fluid channel, sometimes upstream of the flow sensor. When so configured, and during operation of the flow sensor assembly, a fluid may pass through the inlet flow port, through the porous insert, across the flow sensor, and through the outlet flow port.Type: GrantFiled: March 22, 2010Date of Patent: March 19, 2013Assignee: Honeywell International Inc.Inventors: Richard C. Sorenson, Mohammad Abdul Javvad Qasimi, Jamie Speldrich
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Publication number: 20130055826Abstract: A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.Type: ApplicationFiled: September 6, 2011Publication date: March 7, 2013Applicant: Honeywell International Inc.Inventors: Mohammed Abdul Javvad Qasimi, Lamar Floyd Ricks
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Publication number: 20120192645Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.Type: ApplicationFiled: March 29, 2012Publication date: August 2, 2012Applicant: HONEYWELL INTERNATIONAL INC.Inventors: SCOTT E. BECK, PAUL P. BEY, JAMIE SPELDRICH, MOHAMMED A. JAVVAD QASIMI
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Patent number: 8161811Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.Type: GrantFiled: December 18, 2009Date of Patent: April 24, 2012Assignee: Honeywell International Inc.Inventors: Scott E. Beck, Paul P. Bey, Jamie Speldrich, Mohammed A. Javvad Qasimi
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Publication number: 20120035866Abstract: This disclosure relates generally to flow sensors, and more particularly, to flow sensors that include a pressure related output signal. In one example, a flow sensor assembly may include a housing with an inlet flow port, an outlet flow port and a fluid channel extending therebetween, with a flow sensing element positioned in the housing and exposed to the fluid channel. A filter insert may be situated in the fluid channel, sometimes upstream of the flow sensor. When so configured, the flow sensor assembly may output a pressure or differential pressure based, at least in part, on a value of the flow rate through the fluid channel as sensed by the flow sensor.Type: ApplicationFiled: October 14, 2011Publication date: February 9, 2012Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Mohammed Abdul Javvad Qasimi, William Hoover, Richard Charles Sorenson, Craig Scott Becke
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Publication number: 20110226053Abstract: The present disclosure relates generally to flow sensors, and more particularly, to methods and devices for reducing variations in fluid flow across the flow sensor for increased accuracy and/or reliability. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port and an outlet flow port. The housing defines a fluid channel extending between the inlet flow port and the outlet flow port, with a flow sensor positioned in the housing and exposed to the fluid channel. The flow sensor is configured to sense a measure related to the flow rate of a fluid flowing through the fluid channel. A porous insert is situated in the fluid channel, sometimes upstream of the flow sensor. When so configured, and during operation of the flow sensor assembly, a fluid may pass through the inlet flow port, through the porous insert, across the flow sensor, and through the outlet flow port.Type: ApplicationFiled: March 22, 2010Publication date: September 22, 2011Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Richard C. Sorenson, Mohammad Abdul Javvad Qasimi, Jamie Speldrich
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Publication number: 20110146398Abstract: A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.Type: ApplicationFiled: December 18, 2009Publication date: June 23, 2011Applicant: HONEYWELL INTERNATIONAL INC.Inventors: SCOTT E. BECK, PAUL P. BEY, JAMIE SPELDRICH, MOHAMMED A. JAVVAD QASIMI