Abstract: The present invention provides a method for forming an anticorrosion layer, and more particularly, a method for forming an anticorrosion layer against high corrosivity of lead-free solders. The method for forming an anticorrosion layer comprises the steps of firstly providing a article having a metal surface; then providing a ceramic material having oxide, nitride, carbide, boride or a mixture of oxide, nitride, carbide and boride; then adhering the ceramic material to the metal surface of the article; and finally bonding the ceramic material to the metal surface of the article. Said article is a tin slot, peripherals of the tin slot or a temperature probe.