Patents by Inventor Jawad F. Adham

Jawad F. Adham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector implemented with fiber optic means and site therein for integrated circuit chips
    Patent number: 4373778
    Abstract: A single level packaging arrangement and connector for large or very large scale integrated circuit chips is disclosed. This arrangement utilizes dual function optical transducers and fiber optic cables as the transmission medium by which most, if not all, chip I/O communication is effected.The top portion of the connector acts as a conductive collar which serves as both a heat sink and a shield against stray external signals. A chip site is formed in the top portion of the connector and the chip removably lodged therein. The top portion of the connector also includes connector pads which are utilized to make solderless connection to deformable chip pads and to dual purpose optical transducers. Thermal grease, which is forced into and fills site cavities provided for that purpose, assists in conducting heat from within the connector to thereby enhance the heat dissipation characteristics of the chip site.
    Type: Grant
    Filed: December 30, 1980
    Date of Patent: February 15, 1983
    Assignee: International Business Machines Corporation
    Inventor: Jawad F. Adham