Abstract: A reflector is mounted to an outer perimeter of a heat sink holding at least one edge-emitting semiconductor chip, for example a laser diode. The reflector has a shape suitable for gathering light emitted by the laser diodes and redirecting the light in an upward direction away from the heat sink. The reflector can be overmolded onto the heat sink. The reflector can operate by total internal reflection, so that no additional reflector coating step is required. Injection molding of the reflectors onto the heat sink holding the laser diodes enables mass production of powerful yet inexpensive laser light sources.

Abstract: An array of laser diode emitters is used as an illumination source for a range imaging system. The laser diode emitters are disposed on a common substrate. When one of the emitters fails, the remaining emitters emit enough light to meet the output optical power specification. The emitters can be disposed with a tight spacing. The tight spacing facilitates packaging of the entire array into a compact single package on a common heat sink.

Abstract: The present invention relates to the packaging of high power laser(s) in a surface mount technology (SMT) configuration at low-cost using wafer-scale processing. A reflective sidewall is used to redirect the output emission from edge-emitting lasers through an optical element (e.g., a diffuser, lens, etc.). A common electrical pad centered inside the package provides p-side connection to multiple laser diodes (i.e. for power scalability). Thick plating (e.g. 75 um to 125 um) with a heat and electrically conductive material, e.g. copper, on a raised bonding area of a substrate provides good heat dissipation and spreading to the substrate layer during operation. The composite CTE of the substrate layer, e.g. AlN, and the heat/electrical conductive plating, e.g. Cu, substantially matches well with the laser substrates, e.g. GaAs-based, without the requirement for an additional submount.

Abstract: A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Abstract: Multi-mode diode emitters are stacked in a staircase formation to provide a spatially-mulitplexed output. Improved coupling efficiency is achieved by providing tilted collimated output beams that determine an effective step height of the stepped structure. Since the effective step height is dependent on the tilt angle, a variable number of emitters can be used inside packages having a same physical step height, while still attaining high coupling efficiency.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: The present invention relates to the packaging of high power laser(s) in a surface mount technology (SMT) configuration at low-cost using wafer-scale processing. A reflective sidewall is used to redirect the output emission from edge-emitting lasers through an optical element (e.g., a diffuser, lens, etc.). A common electrical pad centered inside the package provides p-side connection to multiple laser diodes (i.e. for power scalability). Thick plating (e.g. 75 um to 125 um) with a heat and electrically conductive material, e.g. copper, on a raised bonding area of a substrate provides good heat dissipation and spreading to the substrate layer during operation. The composite CTE of the substrate layer, e.g. AlN, and the heat/electrical conductive plating, e.g. Cu, substantially matches well with the laser substrates, e.g. GaAs-based, without the requirement for an additional submount.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

Abstract: A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Abstract: A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Abstract: The present invention relates to a component assembly and to a method of fabricating such a component assembly. The component assembly includes a substrate, a mount attached to the substrate, and a component attached to the mount with solder by melting the solder with light from a light source. The mount is composed of a ceramic material having properties advantageous for soldering using a light source. As a first property, the ceramic material is optically absorptive to enable the mount to be heated by the light from the light source. As a second property, the ceramic material has a first thermal conductivity at an operating temperature of the component and a second thermal conductivity at a melting point of the solder, the second thermal conductivity being at least 25% lower than the first thermal conductivity.

Abstract: The invention provides a fiber pigtail assembly wherein a polarization maintaining fiber is soldered directly to a mounting pad without a sleeve or a ferrule therebetween. A portion of the polarization maintaining fiber near a fiber end is embedded in a vertical slow axis orientation within an asymmetrical solder ball having a flat portion for adhering to the mounting pad. The vertical slow axis orientation of the polarization maintaining fiber within the solder ball enhances power stability and polarization extinction ratio properties of optical modules utilizing the invention.

Abstract: The present invention relates to a component assembly and to a method of fabricating such a component assembly. The component assembly includes a substrate, a mount attached to the substrate, and a component attached to the mount with solder by melting the solder with light from a light source. The mount is composed of a ceramic material having properties advantageous for soldering using a light source. As a first property, the ceramic material is optically absorptive to enable the mount to be heated by the light from the light source. As a second property, the ceramic material has a first thermal conductivity at an operating temperature of the component and a second thermal conductivity at a melting point of the solder, the second thermal conductivity being at least 25% lower than the first thermal conductivity.

Abstract: The invention provides a fiber pigtail assembly wherein a polarization maintaining fiber is soldered directly to a mounting pad without a sleeve or a ferrule therebetween. A portion of the polarization maintaining fiber near a fiber end is embedded in a vertical slow axis orientation within an asymmetrical solder ball having a flat portion for adhering to the mounting pad. The vertical slow axis orientation of the polarization maintaining fiber within the solder ball enhances power stability and polarization extinction ratio properties of optical modules utilizing the invention.

Abstract: A high power light source having an array, bundle or separate plurality of laser diodes coupled to a same number of multimode waveguides to collect beams of light emitted from the of laser diodes is provided. An optical combiner receives the beams of light and combines the beams of light into a single forward propagating beam of light so that substantially all optical radiation within each beam of light overlaps the optical radiation each other beam to form the single beam. A reflective element is located to receive the single forward propagating beam of light and transmits greater than 60% of the single forward propagating beam of light therethrough. The reflective element reflects between 3–40% of the single forward propagating beam back to the laser diodes as feedback to stabilize said laser diodes.

Abstract: An optical fiber laser has an output that is stabilized to adapt to changes in laser operating temperature. At the output of the laser a plurality of wavelength-selective stabilizing reflectors is provided, each having a reflectivity profile with a different center wavelength. The reflectors, typically Bragg gratings, have a relative degree of reflectivity and relative wavelength separation that results in the output power of the laser being at one or more of the reflector center wavelengths throughout the temperature change. Thus, as a temperature shift causes the wavelength of the optical energy generated in the laser gain medium to change, the grating-stabilized output of the laser shifts between one locked wavelength and another. However, the output remains stable over the extended wavelength range provided by the multiple reflectors. Such a laser is particularly useful in an amplifier system in which the laser is used as an optical pump source.

Abstract: A high power light source having an array, bundle or separate plurality of laser diodes coupled to a same number of multimode waveguides to collect beams of light emitted from the of laser diodes is provided. An optical combiner receives the beams of light and combines the beams of light into a single forward propagating beam of light so that substantially all optical radiation within each beam of light overlaps the optical radiation each other beam to form the single beam. A reflective element is located to receive the single forward propagating beam of light and transmits greater than 60% of the single forward propagating beam of light therethrough. The reflective element reflects between 3-40% of the single forward propagating beam back to the laser diodes as feedback to stabilize said laser diodes.

Abstract: A fiber tail assembly (FTA) with a micro-lens formed in the fiber tip is used to couple the laser light out of the package and along the fiber. The FTA is soldered at two points where metallized bands are deposited on the fiber pigtail, one at a fiber mount near the diode where it can be soldered into alignment with the laser diode, and two at the snout which forms a feed through the housing and seal for the package. Typically, the FTA is metallized along its entire length within the package. In this invention the two-metallized bands are separated by a region that is unmetallized.