Abstract: A re-sealing puncturable closure for use with vials having calibration or control solutions chemicals therein adapted for use in a manner that advantageously minimizes evaporation from a solution vial prior to and subsequent to aspiration of solution therefrom.

Abstract: A re-sealing puncturable stopper for use with capped vials having lyophilized calibration chemicals therein adapted for use in a manner that minimizes failure modes: (1) in an initial lyophilization manufacturing process; (2) during a subsequent hydration process; (3) while protecting a vial stored on-board an automated clinical analyzer; (4) when punctured for aspiration; and, (5) when re-sealing the vial after aspiration.

Abstract: An annealing mold and fiber retaining device includes a fiber holding plate having fiber channels and an annealing insert. Retainers are provided for attachment to the plate to retain fibers in the channels. After annealing, the annealing insert is replaced by a packaging insert. The fiber holding plate is mounted between a support plate and a cover plate. The mounted plates include a coextensive current conductor port and the plates are mounted in a housing which includes vibration mounts for isolating the plates from vibration within the housing.

Abstract: Interconnect sockets (10) are assembled with substrates, such as printed circuit cards (12), to connect the leads (17) of electrical components (18) to conductive pads (14) deposited on the substrate. Each socket has an end section (19)inserted into a mounting hole (11) in the substrate, for gripping portions of the walls of the hole to mount the socket to the board; a midsection (13) for contacting the conductive pad; and a lead-engaging section (16) for gripping the component lead and connecting it to the pad through the socket. Preferably, the socket is a tubular member of a conductively plated spring metal, with spring members (20, 22, 30) for resiliently engaging the walls of the hole, the contact pad, and the lead. The sockets are especially useful with thermosetting conductive-particle/resin conductors, such as silver-epoxy or -acrylic resin "thick-film " conductive inks.

Abstract: Interconnect sockets (10) are assembled with substrates, such as printed circuit cards (12), to connect the leads (17) of electrical components (18) to conductive pads (14) deposited on the substrate. Each socket has an end section (19) inserted into a mounting hole (11) in the substrate, for gripping portions of the walls of the hole to mount the socket to the board; a midsection (13) for contacting the conductive pad; and a lead-engaging section (16) for gripping the component lead and connecting it to the pad through the socket. Preferably, the socket is a tubular member of a conductively plated spring metal, with spring members (20, 22, 30) for resiliently engaging the walls of the hole, the contact pad, and the lead. The sockets are especially useful with thermosetting conductive-particle/resin conductors, such as silver-epoxy or -acrylic resin "thick-film" conductive inks.

Abstract: A carrier support apparatus is provided for attachment to a bicycle frame and connection to auxiliary structures such as baskets, hampers and the like and which comprises a horizontally oriented support rack adapted for mounting on the rear portion of a bicycle frame. The support rack is provided with an integral biased buttress-engaging latch in the forward narrow neck portion thereof, the sides of the rear portion thereof are tapered rearwardly and outwardly so as to form a wide tapered rear support platform. An auxiliary detachable bicycle seat or carrier element is provided which is adapted for selective snap engagement with the support rack. The bottom portion of the bicycle seat or carrier element is provided with a downwardly extending support rack engaging channel portion adapted for selective mating engagement with the tapered portion of the support rack.