Patents by Inventor Jay A. Williams

Jay A. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210249151
    Abstract: A cable for transmitting electricity may include a core including a first conductive material, a core shield surrounding the core, an insulation layer surrounding the core shield, the insulation layer comprising a material providing electrical insulating properties, an insulation shield surrounding the insulation layer; and at least one of the following at least partially surrounding the insulation shield: (a) a bedding layer including a first semi-conductive material, (b) a tape layer including a metallic tape intercalated with an insulating tape, and (c) a protection layer.
    Type: Application
    Filed: April 26, 2021
    Publication date: August 12, 2021
    Inventors: Tiebin Zhao, Jay A. Williams, Richard W. Allen, JR., Frank Frentzas, Ronald J. Knapwurst, Mohammad Anwar Pasha, Mark Rogers Smith
  • Patent number: 10991479
    Abstract: A cable for transmitting electricity may include a core including a first conductive material, a core shield surrounding the core, an insulation layer surrounding the core shield, the insulation layer comprising a material providing electrical insulating properties, an insulation shield surrounding the insulation layer; and at least one of the following at least partially surrounding the insulation shield: (a) a bedding layer including a first semi-conductive material, (b) a tape layer including a metallic tape intercalated with an insulating tape, and (c) a protection layer.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 27, 2021
    Assignee: Electric Power Research Institute, Inc.
    Inventors: Tiebin Zhao, Jay A. Williams, Richard W. Allen, Jr., Frank Frentzas, Ronald J. Knapwurst, Mohammad Anwar Pasha, Mark Rogers Smith
  • Publication number: 20200234845
    Abstract: A cable for transmitting electricity may include a core including a first conductive material, a core shield surrounding the core, an insulation layer surrounding the core shield, the insulation layer comprising a material providing electrical insulating properties, an insulation shield surrounding the insulation layer; and at least one of the following at least partially surrounding the insulation shield: (a) a bedding layer including a first semi-conductive material, (b) a tape layer including a metallic tape intercalated with an insulating tape, and (c) a protection layer.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 23, 2020
    Inventors: Tiebin Zhao, Jay A. Williams, Richard W. Allen, JR., Frank Frentzas, Ronald J. Knapwurst, Mohammad Anwar Pasha, Mark Rogers Smith
  • Patent number: 10243332
    Abstract: A method of replacing pipe-type power cables is disclosed. The method includes the steps of using a pipe cutting rod to burst existing pipe; using an expander to expand soil surrounding the existing pipe to create a path for a new conduit or pipe; pulling the new conduit or pipe into the path created by the expander; and pulling new cables into the conduit or pipe.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: March 26, 2019
    Assignee: Electric Power Research Institute, Inc.
    Inventors: Tiebin Zhao, Jay A. Williams
  • Publication number: 20190074671
    Abstract: A method of replacing pipe-type power cables is disclosed. The method includes the steps of using a pipe cutting rod to burst existing pipe; using an expander to expand soil surrounding the existing pipe to create a path for a new conduit or pipe; pulling the new conduit or pipe into the path created by the expander; and pulling new cables into the conduit or pipe.
    Type: Application
    Filed: September 5, 2017
    Publication date: March 7, 2019
    Inventors: Tiebin Zhao, Jay A. Williams
  • Publication number: 20100171395
    Abstract: An ultrasonic array transducer having an array of piezoelectric elements may be made with a curvature which may enable the piezoelectric elements to control the way in which ultrasonic energy is focused by the transducer. A substrate that has a set of element electrodes on a surface of the substrate may be created. Each element electrode may be electrically isolated from the others and configured to correspond to the location of one of the piezoelectric elements. A piezoelectric component which includes piezoelectric material may be bonded to the substrate such that each element electrode is juxtaposed next to the piezoelectric component. The surface of the substrate and/or to the piezoelectric material may have the curvature while they are separated and prior to the bonding. The bonding may be performed in a manner that results in the array of piezoelectric elements having the curvature.
    Type: Application
    Filed: October 23, 2009
    Publication date: July 8, 2010
    Applicant: UNIVERSITY OF SOUTHERN CALIFORNIA
    Inventors: Jonathan M. Cannata, Jay A. Williams, K. Kirk Shung
  • Patent number: 7695784
    Abstract: Methods and systems are described for making posts and kerfs in an interdigital bonded composite. The desired alignment criteria for a plurality of posts and kerfs in a pair of slabs are determined, as well as the desired widths W of the posts and the desired widths K of the kerfs. The posts in the first slab are configured to be received into corresponding kerfs in the second slab, and vice versa, so that the pair of slabs can be interdigitated to generate a composite. At least one of an alignment post and an alignment kerf are created, in at least one of the slabs. The alignment posts and the alignment kerf are configured to allow the plurality of posts and kerfs to be correctly positioned and aligned, in accordance with the desired alignment criteria.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: April 13, 2010
    Assignee: University of Southern California
    Inventors: Jay A. Williams, Jonathan M. Cannata, Ruibin Liu, K. Kirk Shung