Patents by Inventor Jay Akhave
Jay Akhave has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11069963Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.Type: GrantFiled: September 15, 2010Date of Patent: July 20, 2021Assignee: Avery Dennson CorporationInventors: James P. Coleman, Jay Akhave, Eric Dimalanta
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Patent number: 10186765Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.Type: GrantFiled: May 23, 2011Date of Patent: January 22, 2019Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLCInventors: James P. Coleman, Jay Akhave, Eric Dimalanta
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Patent number: 8786510Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.Type: GrantFiled: January 24, 2006Date of Patent: July 22, 2014Assignee: Avery Dennison CorporationInventors: James P. Coleman, Jay Akhave, Eric Dimalanta
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Patent number: 8191230Abstract: Methods of making an radio frequency (RF) antenna containing element are provided. The methods comprise providing a metal foil laminate bonded to a carrier layer. The metal foil laminate can have a metal foil layer bonded to a reinforcement layer. The methods further comprise cutting an antenna pattern through the metal foil laminate to the carrier layer, and removing an undesired matrix portion of the reinforced metal foil laminate to provide a metal foil laminate antenna disposed on the carrier layer.Type: GrantFiled: April 20, 2009Date of Patent: June 5, 2012Assignee: Avery Dennison CorporationInventors: James P. Coleman, Jay Akhave, Eric Dimalanta
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Publication number: 20110220276Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.Type: ApplicationFiled: May 23, 2011Publication date: September 15, 2011Applicant: AVERY DENNISON CORPORATIONInventors: James P. COLEMAN, Jay AKHAVE, Eric DIMALANTA
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Patent number: 7989313Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: GrantFiled: April 16, 2008Date of Patent: August 2, 2011Assignee: Avery Dennison CorporationInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave N. Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Publication number: 20110001670Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.Type: ApplicationFiled: September 15, 2010Publication date: January 6, 2011Applicant: AVERY DENNISON CORPORATIONInventors: James P. COLEMAN, Jay AKHAVE, Eric DIMALANTA
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Publication number: 20090199966Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.Type: ApplicationFiled: April 20, 2009Publication date: August 13, 2009Applicant: Avery Dennison CorporationInventors: James P. COLEMAN, Jay AKHAVE, Eric DIMALANTA
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Publication number: 20080194059Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: ApplicationFiled: April 16, 2008Publication date: August 14, 2008Inventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave N. Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Patent number: 7364983Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: GrantFiled: May 4, 2005Date of Patent: April 29, 2008Assignee: Avery Dennison CorporationInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave N. Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Publication number: 20070171129Abstract: A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.Type: ApplicationFiled: January 24, 2006Publication date: July 26, 2007Inventors: James Coleman, Jay Akhave, Eric Dimalanta
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Publication number: 20060252182Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.Type: ApplicationFiled: May 4, 2005Publication date: November 9, 2006Applicant: AVERY DENNISON CORPORATIONInventors: Haochuan Wang, Ali Mehrabi, Kouroche Kian, Dave Edwards, Akiko Tanabe, Mark Licon, Jay Akhave
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Publication number: 20050152955Abstract: A electrostatically self-assembled coating having a biologically active agent incorporated therein is provided. More particularly, a wound dressing having an antimicrobial coating within the dressing construction wherein an antimicrobial agent is released from the dressing over a period of time is produced using a layer-by-layer deposition process.Type: ApplicationFiled: December 16, 2004Publication date: July 14, 2005Inventors: Jay Akhave, Jan Carr, Jaime Grunlan, Albert Lin
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Publication number: 20050109606Abstract: In one embodiment, the invention relates to a method of depositing a silicon nitride based coating on a plastic substrate to form a composite barrier film which comprises depositing a silicon nitride based coating on the substrate by sputtering of a silicon target in an atmosphere comprising at least about 75% by volume nitrogen. In another embodiment, the composite films prepared by the method of the invention comprise a silicon nitride based coating on a flexible plastic substrate wherein the silicon nitride based coating has a thickness of less than about 220 nm and a visible light transmittance of at least about 75%.Type: ApplicationFiled: October 21, 2004Publication date: May 26, 2005Inventors: Xiao-Ming He, Ramin Heydarpour, Ali Mehrabi, Jay Akhave
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Publication number: 20030134033Abstract: The present invention is directed generally to methods and apparatus for the efficient identification of components, formulations and materials produced therefrom. More particularly, the invention relates to automated apparatus and associated methods of utilizing arrays of materials for expeditious screening, testing, identification and optimization of formulations of materials and application parameters that provide novel materials having desired physical characteristics.Type: ApplicationFiled: October 2, 2002Publication date: July 17, 2003Applicant: Avery Dennison CorporationInventors: Daniel L. Holguin, Jay Akhave, Hsiao Ken Chuang, Jessie Reaves, Carol A. Koch, Ali Mehrabi, Mark Licon, Dennis Saunders