Patents by Inventor Jay Alexander

Jay Alexander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250045381
    Abstract: In one example method metadata about one or more entities of a ransomware threat and one or more relationships between the one or more entities of the ransomware threat is extracted from received cyber threat intelligence data by a threat decipher engine. The metadata about the one or more entities of the ransomware threat and the one or more relationships between the one or more entities of the ransomware threat is stored in a repository. A ransomware attack type included in received security sensor data is predicted by a threat prediction engine based on the metadata about the one or more entities of the ransomware threat and the one or more relationships between the one or more entities of the ransomware threat.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Vinotth Ramalingam, Jay Alexander, Bijan Kumar Mohanty
  • Patent number: 7193487
    Abstract: A multi-layer cross connect having high isolation between signal channels, the multi-layer cross connect comprising: (a) a multi-layer circuit board having a top and bottom orientation and comprising at least a bottom layer and one or more upper layers; (b) a plurality of microstrip launches along the perimeter of the bottom layer; (c) a plurality of striplines on the bottom layer, each stripline being connected to one and only one microstrip launch and comprising a transformer for lowering its impedance and thereby increasing its width, the striplines comprising first striplines and second striplines; (d) a plurality of transition vias, each transition via conductively coupling each of the second striplines to a stripline on an upper layer; and (e) a combiner on each layer for combining signals from multiple striplines to a common stripline.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: March 20, 2007
    Assignee: M/A-Com, Inc.
    Inventors: Jay Alexander, Anthony Cappello, Raymond Kaarsberg, Robert Patukonis
  • Publication number: 20060139119
    Abstract: A multi-layer cross connect having high isolation between signal channels, the multi-layer cross connect comprising: (a) a multi-layer circuit board having a top and bottom orientation and comprising at least a bottom layer and one or more upper layers; (b) a plurality of microstrip launches along the perimeter of the bottom layer; (c) a plurality of striplines on the bottom layer, each stripline being connected to one and only one microstrip launch and comprising a transformer for lowering its impedance and thereby increasing its width, the striplines comprising first striplines and second striplines; (d) a plurality of transition vias, each transition via conductively coupling each of the second striplines to a stripline on an upper layer; and (e) a combiner on each layer for combining signals from multiple striplines to a common stripline.
    Type: Application
    Filed: December 23, 2004
    Publication date: June 29, 2006
    Applicant: Tyco Electronics Corporation
    Inventors: Jay Alexander, Anthony Cappello, Raymond Kaarsberg, Robert Patukonis
  • Patent number: 5696029
    Abstract: A lead frame design and manufacturing process comprising a lead frame (18) having its internal lead fingers (20) punched out to dimensions optimized to accommodate the body size of a selected die. A die pad (30), also optimized to accommodate the body size of the selected die, is attached to the lead frame with mechanical or chemical bonding. Punches are used to punch out the internal lead pins according to selected dimensions.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: December 9, 1997
    Assignee: Texas Instruments Incorporated
    Inventors: Robert Alvarez, Anthony M. Chiu, Jay Alexander