Patents by Inventor Jay Allen Yoder

Jay Allen Yoder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and laminated leadframe package
    Patent number: 6768186
    Abstract: An semiconductor device (100) comprising a first semiconductor die (120) and a leadframe (200). The leadframe includes a first laminate (210) having a bottom surface formed with a lead (220) of the semiconductor device, a second laminate (230) overlying the first laminate for mounting the semiconductor die, and an adhesive tape (250) for attaching the first and second laminates.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: July 27, 2004
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: James P. Letterman, Jr., Joseph K. Fauty, Jay Allen Yoder
  • Semiconductor device and laminated leadframe package
    Publication number: 20040070062
    Abstract: An semiconductor device (100) comprising a first semiconductor die (120) and a leadframe (200). The leadframe includes a first laminate (210) having a bottom surface formed with a lead (220) of the semiconductor device, a second laminate (230) overlying the first laminate for mounting the semiconductor die, and an adhesive tape (250) for attaching the first and second laminates.
    Type: Application
    Filed: October 15, 2002
    Publication date: April 15, 2004
    Applicant: Semiconductor Components Industries, LLC.
    Inventors: James P. Letterman, Joseph K. Fauty, Jay Allen Yoder