Abstract: A cable connection/dispensing system for a multi-rotation assembly includes a hollow cylindrical housing and an elongated central hub centered within the housing. The hub has a cardioid cross-sectional shape with two lobes and an acute cusp therebetween. At least one of the housing and the hub is rotatable. A first cable connector is located on the hollow housing and faces its interior, and a second cable connector is located at the acute cusp of the central hub. A length of an interconnect medium lies between the hollow housing and the central hub. The interconnect medium includes an interconnect cable attached at a first end to the first cable connector and at a second end to the second cable connector, and an interconnect medium substrate to which the interconnect cable is attached. Rotation of the hub with respect to the housing results in a smooth payout and takeup of the cable medium for a number of turns corresponding to about twice the length of the interconnect medium.

Abstract: A high density fiber optic cable including a cylindrical core member having a number of helical grooves extending along its length. Up to a hundred or more optical fibers are placed into each helical groove. The core member and fibers are covered by an outer member which retains the fibers and acts as an environmental seal. A strength member can be placed within an internal void in the core or the outer member can act as the strength member. Where the outer member is the strength member, additional cables may be placed within the internal void.

Abstract: An expandable and contractable sealed environment is provided by a rigid frame member and a pair of deformable heat transfer elements fixed to the frame member. The frame member is located between two heat-producing electronic assemblies. A coolant agent is pumped into the sealed environment to flex the membranes and cause them to conformally contact the pair of electronic assemblies. Excess heat in the assemblies is then allowed to pass across the membranes and into the coolant agent for dissipation purposes. In order to remove the electronic assemblies, the pressure of the coolant agent is reduced, which permits the heat transfer element to return to its nondeformed state removed from the assembly. Thus, the electronic assemblies can be removed without the need to open fluid couplings.