Abstract: Microphones including a housing defining a cavity, a plurality of conductors positioned within the cavity, at least one dielectric bar positioned within the cavity, and a transducer diaphragm. The conductors are structured to move in response to pressure changes while the housing remains fixed. A first conductor generates first electrical signals responsive to the pressure changes resulting from changes in an atmospheric pressure. A second conductor generates second electrical signals responsive to the pressure changes resulting from acoustic activity. The dielectric bar is fixed with respect to the cavity and remains fixed under the pressure changes. The dielectric bar is adjacent to at least one of the conductors. In response to an applied pressure that is an atmospheric pressure and/or an acoustic pressure, the transducer diaphragm exerts a force on the housing and displaces at least a portion of conductors with respect to the dielectric bar.

Abstract: Disclosed herein are related to a touch sensitive device. The touch sensitive device includes a panel with a surface including a tactile interface, where the tactile interface has surface variations forming a tactile pattern. In one aspect, tactile interaction with the tactile pattern produces an energy signature representative of the surface variations. In one aspect, the touch sensitive device further includes an electro-mechanical transducer configured to generate an electrical output signal in response to detecting the energy signature. In one aspect, an output of the electro-mechanical transducer is connectable to a processor configured to produce a control signal based on the electrical output signal of the electro-mechanical transducer.

Abstract: Microphones including a housing defining a cavity, a plurality of conductors positioned within the cavity, at least one dielectric bar positioned within the cavity, and a transducer diaphragm. The conductors are structured to move in response to pressure changes while the housing remains fixed. A first conductor generates first electrical signals responsive to the pressure changes resulting from changes in an atmospheric pressure. A second conductor generates second electrical signals responsive to the pressure changes resulting from acoustic activity. The dielectric bar is fixed with respect to the cavity and remains fixed under the pressure changes. The dielectric bar is adjacent to at least one of the conductors. In response to an applied pressure that is an atmospheric pressure and/or an acoustic pressure, the transducer diaphragm exerts a force on the housing and displaces at least a portion of conductors with respect to the dielectric bar.

Abstract: A tool includes a collet, a vacuum path, and a top die. The collet has a first end and a second end. The second end is configured so as to be coupled to an air suction device. The vacuum path is formed inside and along a length of the collet and extends from the first end to the second end of the collet. The top die is coupled to the first end of the collet. The top die includes a plurality of raised islands, and each of the plurality of raised islands including a hole. The hole communicates with the vacuum path such that a suction applied by the suction device draws air through the hole and then through the vacuum path and is sufficient to pick up a MEMS component disposed in proximity to the hole.

Abstract: Mechanically activated objects or devices for use in treating degenerative retinal diseases are provided. Such devices apply mechanical forces to tissues of an eye to effectuate treatment and are configured for chronic implantation (thereby applying chronic stimulation/irritation) in or on the eye. The devices may be configured for contact with a retina of the eye, preferably positioned in a subretinal space. Various embodiments comprise a moving member configured for chronic contact with at least a portion of the eye, which moving member is activated by an actuator. In some embodiments, the actuator may be distally located relative to the moving member. Alternatively, the moving member may be supported by a body member that, optionally, also supports the actuator.

Abstract: Mechanically activated objects or devices for use in treating degenerative retinal diseases are provided. Such devices apply mechanical forces to tissues of an eye to effectuate treatment and are configured for chronic implantation (thereby applying chronic stimulation/irritation) in or on the eye. The devices may be configured for contact with a retina of the eye, preferably positioned in a subretinal space. Various embodiments comprise a moving member configured for chronic contact with at least a portion of the eye, which moving member is activated by an actuator. In some embodiments, the actuator may be distally located relative to the moving member. Alternatively, the moving member may be supported by a body member that, optionally, also supports the actuator.

Abstract: A directed energy source is applied to a portion of a material, creating at least one altered region and leaving at least one unaltered region. The material is exposed to an etchant which removes the at least one altered region leaving substantially all of the unaltered region.

Abstract: Mechanically activated objects or devices for use in treating degenerative retinal diseases are provided. Such devices apply mechanical forces to tissues of an eye to effectuate treatment and are configured for chronic implantation (thereby applying chronic stimulation/irritation) in or on the eye. The devices may be configured for contact with a retina of the eye, preferably positioned in a subretinal space. Various embodiments comprise a moving member configured for chronic contact with at least a portion of the eye, which moving member is activated by an actuator. In some embodiments, the actuator may be distally located relative to the moving member. Alternatively, the moving member may be supported by a body member that, optionally, also supports the actuator.

Abstract: A method for fabricating thin-film multilayer interconnect signal planes for connecting semiconductor integrated circuits (chips) is described. In this method, a first pattern of thin-film metallic interconnect lines is formed on a surface of a substrate. Then a first dielectric layer is formed over the entire surface of the substrate covering the pattern of thin-film metallic interconnect lines. A portion of the dielectric layer is then removed to expose the thin-film metallic interconnect lines so that a series of trenches is formed above each interconnect line. The interconnect lines are then electroplated to form a series of thicker metal interconnect lines such that the thicker metal interconnect lines and the dielectric layer form a substantially planar surface. This process can then be repeated in its entirely to form a plurality of interconnect signal planes. In the preferred embodiment, metallic vias are provided between each layer of metallic interconnect lines for electrical connection purposes.

Abstract: A method for fabricating thin-film multilayer interconnect signal planes for connecting semiconductor integrated circuits is described. In this method, a first pattern of thin-film metallic interconnect lines is formed on a surface of a substrate. Then a first dielectric layer is formed over the entire surface of the substrate covering the pattern of thin-film metallic interconnect lines. A portion of the dielectric layer is then removed to expose the thin-film metallic interconnect lines so that a series of trenches is formed above each interconnect line. The interconnect lines are then electroplated to form a series of thicker metal interconnect lines such that the thicker metal interconnect lines and the dielectric layer form a substantially planer surface. This process can then be repeated in its entirely to form a plurality of interconnect signal planes. In the preferred embodiment, metallic vias are provided between each layer of metallic interconnect lines for electrical connection purposes.