Abstract: A conductive element (FIG. 1, 220) incorporates a wide end portion (230) which is subdivided into a set of low impedance coupling paths (235) separated by one of the planar grooves (250). Each of the low impedance coupling paths (235) is suitable for coupling to a corresponding solid-state amplifier device (210). Power from each solid-state amplifier device (210) is combined at a narrow end portion (240) and conveyed to a transmission line (260). The high frequency low loss power combiner requires minimal integrated circuit chip area and can be designed and fabricated using existing microstrip analysis and design tools. Additionally, the substantially fully metallic structure provides additional excess heat dissipation through increased surface area over that of the Wilkenson power combiner. Further, due the broad conductive path formed by the conductive element, resistive losses are also minimized, thus increasing overall device efficiency.