Patents by Inventor Jay CHAO

Jay CHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid compression molding or encapsulant compositions
    Patent number: 12187843
    Abstract: Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: January 7, 2025
    Assignee: Henkel AG & Co. KGaA
    Inventors: Jay Chao, Gina V. Hoang, Rong Zhang
  • LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY
    Publication number: 20240301129
    Abstract: Thermosetting resin compositions in a flowable state useful for liquid compression molding (“LCM”) or stencil printing application are provided, reaction products of which become non-flowable after exposure to an elevated temperature and are then platable upon exposure to laser energy.
    Type: Application
    Filed: May 17, 2024
    Publication date: September 12, 2024
    Inventors: Chunlin He, Timothy M. Champagne, Jay Chao, Ruud de Wit
  • LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS
    Publication number: 20210163674
    Abstract: Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.
    Type: Application
    Filed: February 12, 2021
    Publication date: June 3, 2021
    Inventors: Jay CHAO, Gina V. HOANG, Rong ZHANG