Patents by Inventor Jay Chiu

Jay Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240021468
    Abstract: In one example aspect, the present disclosure is directed to a method. The method includes receiving a workpiece having a conductive feature over a semiconductor substrate, forming a sacrificial material layer over the conductive feature, removing first portions of the sacrificial material layer to form line trenches and to expose a top surface of the conductive feature in one of the line trenches; forming line features in the line trenches, removing second portions of the sacrificial material layer to form gaps between the line features, and forming dielectric features in the gaps, the dielectric features enclosing an air gap.
    Type: Application
    Filed: August 8, 2023
    Publication date: January 18, 2024
    Inventors: Yu-Hsin Chan, Cai-Ling Wu, Chang-Wen Chen, Po-Hsiang Huang, Yu-Yu Chen, Kuan-Wei Huang, Jr-Hung Li, Jay Chiu, Ting-Kui Chang
  • Publication number: 20220359263
    Abstract: In one example aspect, the present disclosure is directed to a method. The method includes receiving a workpiece having a conductive feature over a semiconductor substrate, forming a sacrificial material layer over the conductive feature, removing first portions of the sacrificial material layer to form line trenches and to expose a top surface of the conductive feature in one of the line trenches; forming line features in the line trenches, removing second portions of the sacrificial material layer to form gaps between the line features, and forming dielectric features in the gaps, the dielectric features enclosing an air gap.
    Type: Application
    Filed: July 22, 2021
    Publication date: November 10, 2022
    Inventors: Yu-Hsin Chan, Cai-Ling Wu, Chang-Wen Chen, Po-Hsiang Huang, Yu-Yu Chen, Kuan-Wei Huang, Jr-Hung Li, Jay Chiu, Ting-Kui Chang
  • Patent number: 11378549
    Abstract: A gas sensor comprises a basic part and a sensing layer deposited on the basic part. The basic part includes a circuit board and at least one surface acoustic wave element disposed on the circuit board. The sensing layer is a nanocomposite film of reduced graphene oxide/tungsten oxide/polypyrrole deposited on the surface acoustic wave element. The sensing layer combines reduced graphene oxide, metal oxide, and conductive polymer, so that the sensing layer is able to perform sensing at room temperature, and can be more sensitive. The present invention provides a method for manufacturing a gas sensor, and a gas sensing system including the gas sensor.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: July 5, 2022
    Assignee: I-SHOU UNIVERSITY
    Inventors: Chi-Yen Shen, Tien-Tsan Hung, Jing-Jay Chiu, Ming Wen Yang
  • Publication number: 20210293755
    Abstract: A gas sensor comprises a basic part and a sensing layer deposited on the basic part. The basic part includes a circuit board and at least one surface acoustic wave element disposed on the circuit board. The sensing layer is a nanocomposite film of reduced graphene oxide/tungsten oxide/polypyrrole deposited on the surface acoustic wave element. The sensing layer combines reduced graphene oxide, metal oxide, and conductive polymer, so that the sensing layer is able to perform sensing at room temperature, and can be more sensitive. The present invention provides a method for manufacturing a gas sensor, and a gas sensing system including the gas sensor.
    Type: Application
    Filed: March 20, 2020
    Publication date: September 23, 2021
    Inventors: Chi-Yen SHEN, Tien-Tsan HUNG, Jing-Jay CHIU, Ming Wen YANG