Patents by Inventor Jay DeAvis Baker
Jay DeAvis Baker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7156279Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).Type: GrantFiled: October 3, 2001Date of Patent: January 2, 2007Assignee: Visteon Global Technologie, Inc.Inventors: Lakhi N. Goenke, Charles Frederick Schweitzer, Jason Bullock, legal representative, Shona Bullock, legal representative, Mark D. Miller, Jay DeAvis Baker, Karen Lee Chiles, Achyuta Achari, Lawrence Lernel Bullock, deceased
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Patent number: 7048423Abstract: An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.Type: GrantFiled: September 28, 2001Date of Patent: May 23, 2006Assignee: Visteon Global Technologies, Inc.Inventors: Walter Kuzma Stepanenko, Jay DeAvis Baker, Lawrence LeRoy Kneisel, Richard Keith McMillan, Brenda Joyce Nation, Cindy Maria Rutyna, Charles Frederick Schweitzer, Peter Langer
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Patent number: 7015869Abstract: The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.Type: GrantFiled: November 18, 2002Date of Patent: March 21, 2006Assignee: Visteon Global Technologies, Inc.Inventors: C. Allen Marlow, Jay DeAvis Baker, Lawrence Leroy Kneisel, Rosa Lynda Nuño, William David Hopfe
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Patent number: 7000969Abstract: An automobile instrument panel assembly may be used in the cockpit of an automobile. The assembly includes a cross-car structure having a plurality of recesses and protrusions along the length of the structure and a plurality of generally planar surfaces. A plurality of HVAC components are adapted to closely fit within one or more of the plurality of recesses within the structure, and at least one flatwire bus is affixed to the generally planar surfaces of the structure.Type: GrantFiled: August 30, 2002Date of Patent: February 21, 2006Assignee: Visteon Global Technologies, Inc.Inventors: Jay DeAvis Baker, Myron Lemecha, Jin Zhou, Andrew Zachary Glovatsky, Richard Keith McMillan, Daniel Roger Vander Sluis
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Patent number: 6826829Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.Type: GrantFiled: March 7, 2002Date of Patent: December 7, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Cuong Van Pham, Jay DeAvis Baker, Mohan R. Paruchuri, Prathap Amervai Reddy, Vivek Amir Jairazbhoy
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Patent number: 6821003Abstract: A vehicle lamp that includes an integrated sensor for interacting with an operating environment of a vehicle is provided. The vehicle lamp includes a sensor and a light channel adapted to transmit data received by the sensor. The vehicle lamp can also include a flat wire that has a component integrally formed by the light channel. A vehicle illumination and data transmission system is also provided. The system includes vehicle lamps according to the present invention, and can include sensor processors located within each of a plurality of lamps, or sensor processors that are centrally located within the vehicle. A system processor is connected to the sensor processors and enables operating decisions based upon data received from the environment by the sensors.Type: GrantFiled: July 16, 2002Date of Patent: November 23, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Jay DeAvis Baker, Lawrence LeRoy Kneisel, Paul Kirk Zoratti, Jimmy Attard, Andrew Zachary Glovatsky
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Patent number: 6772733Abstract: An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.Type: GrantFiled: October 15, 2002Date of Patent: August 10, 2004Assignee: Visteon Global Technologies, Inc.Inventors: Zhong-You Shi, Bernard A. Meyer, Harvinder Singh, Jay DeAvis Baker, Lawrence Leroy Kneisel, Richard Keith McMillan, David James Steinert
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Publication number: 20040095214Abstract: The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.Type: ApplicationFiled: November 18, 2002Publication date: May 20, 2004Inventors: C. Allen Marlow, Jay DeAvis Baker, Lawrence Leroy Kneisel, Rosa Lynda Nuno, William David Hopfe
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Publication number: 20040094607Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).Type: ApplicationFiled: August 1, 2003Publication date: May 20, 2004Inventors: Lakhi N. Goenka, Charles Frederick Schweitzer, Lawrence Lernel Bullock, Mark D. Miller, Jay DeAvis Baker, Karen Lee Chiles, Achyuta Achari, Jason Bullock, Shona Bullock
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Publication number: 20040041432Abstract: An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes a cross-car structure having a plurality of recesses and protrusions along the length of the structure and a plurality of generally planar surfaces. A plurality of HVAC components are adapted to closely fit within one or more of the plurality of recesses within the structure, and at least one flatwire bus is affixed to the generally planar surfaces of the structure.Type: ApplicationFiled: August 30, 2002Publication date: March 4, 2004Inventors: Jay DeAvis Baker, Myron Lemecha, Jin Zhou, Andrew Zachary Glovatsky, Richard Keith McMillan, Daniel Roger Vander Sluis
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Publication number: 20040012973Abstract: A vehicle lamp that includes an integrated sensor for interacting with an operating environment of a vehicle is provided. The vehicle lamp includes a sensor and a light channel adapted to transmit data received by the sensor. The vehicle lamp can also include a flat wire that has a component integrally formed by the light channel. A vehicle illumination and data transmission system is also provided. The system includes vehicle lamps according to the present invention, and can include sensor processors located within each of a plurality of lamps, or sensor processors that are centrally located within the vehicle. A system processor is connected to the sensor processors and enables operating decisions based upon data received from the environment by the sensors.Type: ApplicationFiled: July 16, 2002Publication date: January 22, 2004Applicant: Visteon Global Technologies, Inc.Inventors: Jay DeAvis Baker, Lawrence LeRoy Kneisel, Paul Kirk Zoratti, Joe Attard, Andrew Zachary Glovatsky
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Patent number: 6655504Abstract: A braking unit is provided. In one embodiment, the braking unit comprises a base member, a guide member, a flexible rod, an actuator adapted to induce deformation of the rod, and a brake pad. One end of the flexible rod is fixedly attached to the base member while another end is slideably disposed within a passageway defined by the guide member. The brake pad is positioned adjacent the flexible rod such that deformation of the rod causes lateral movement of the brake pad. The braking unit can be incorporated into disc and drum-type braking assemblies and systems.Type: GrantFiled: July 12, 2001Date of Patent: December 2, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Publication number: 20030167630Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.Type: ApplicationFiled: March 7, 2002Publication date: September 11, 2003Inventors: Cuong Van Pham, Jay DeAvis Baker, Mohan R. Paruchuri, Prathap Amervai Reddy, Vivek Amir Jairazbhoy
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Patent number: 6601292Abstract: A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g.Type: GrantFiled: June 26, 2001Date of Patent: August 5, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Delin Li, Jay DeAvis Baker, Achyuta Achari, Brenda Joyce Nation, John Trublowski
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Patent number: 6601753Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.Type: GrantFiled: May 17, 2001Date of Patent: August 5, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Jay DeAvis Baker, Lawrence Leroy Kneisel, Mohan R. Paruchuri, Prathap Amervai Reddy, Vivek Amir Jairazbhoy
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Patent number: 6571820Abstract: A vent assembly that can be concealed when in a closed configuration is provided in one embodiment, the vent assembly comprises a base member and a guide member secured to a mounting surface of a duct or other passageway. A flexible rod is fixedly attached to the base member and slideably disposed within a channel defined by the guide member. A panel is disposed on or around the flexible rod and between the base and guide members. An actuator is able to deform the rod such that the panel moves away from the terminal opening of the duct, thereby opening the vent. A fluid distribution system incorporating vent assemblies in accordance with the present invention is also provided.Type: GrantFiled: July 12, 2001Date of Patent: June 3, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Publication number: 20030089335Abstract: An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.Type: ApplicationFiled: October 15, 2002Publication date: May 15, 2003Inventors: Zhong-You Shi, Bernard A. Meyer, Harvinder Singh, Jay DeAvis Baker, Lawrence Leroy Kneisel, Richard Keith McMillan, David James Steinert
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Patent number: 6555015Abstract: Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.Type: GrantFiled: November 9, 2000Date of Patent: April 29, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Daniel Phillip Dailey, Robert Edward Belke, Jr., Jay DeAvis Baker, Achyuta Achari, Myron Lemecha, Michael George Todd
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Patent number: 6547117Abstract: A container holder for receiving and securing a container is provided. In a preferred embodiment, the container holder comprises a base surface, at least one moldline structure unit, and a sensor. The sensor detects the presence of the container in the holder and induces deformation in the moldline structure unit such that the container is secured in the holder.Type: GrantFiled: July 12, 2001Date of Patent: April 15, 2003Assignee: Visteon Global Technologies, Inc.Inventors: Andrew Zachary Glovatsky, Robert Edward Belke, Jay DeAvis Baker, Joseph Mario Giachino, Lakhi Nandlal Goenka, Myron Lemecha
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Publication number: 20030063477Abstract: An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.Type: ApplicationFiled: September 28, 2001Publication date: April 3, 2003Applicant: Ford Motor Co.Inventors: Walter Kuzma Stepanenko, Jay DeAvis Baker, Lawrence LeRoy Kneisel, Richard Keith McMillan, Brenda Joyce Nation, Cindy Maria Rutyna, Charles Frederick Schweitzer, Peter Langer