Patents by Inventor Jay Denning

Jay Denning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7227242
    Abstract: An etched substrate structure is augmented by conductive material to provide enhanced electrical and/or thermal performance. A semiconductor device substrate comprising active regions defined on a top surface is masked and etched to define a pattern of blind features in a bottom surface of the substrate. A conductive material is then deposited on the surface of the blind features. The replacement of semiconductor material with the conductive material lowers the resistance between the active elements on the top surface and the bottom surface. The blind features may be placed in proximity to parasitic bipolar transistors in order to increase immunity to latchup. During wafer processing, a pattern of grooves aligned opposite to a scribe street pattern may be etched on the wafer back side in order to facilitate the separation of individual devices.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: June 5, 2007
    Assignee: QSpeed Semiconductor Inc.
    Inventors: Chong Ming Lin, Jay Denning, Ho Yuan Yu