Abstract: A packaging structure for an array of semiconductor light sources that provides a heat sink using conduction, convection and radiation of heat. The array, mounted on a base, transfers heat by conduction to a first metal surface slightly spaced apart from a second metal surface. A liquid transfers heat by convection from the first metal surface to the second thereby spreading the heat over both the first and second metal surfaces which can radiate heat to the ambient environment. Where the metal surfaces are cup-shaped, the metal surfaces can form a beam if the light sources are placed near a focal area of a parabolic cup-shaped reflector surface. Optional screw threads allow use in conventional sockets and may house an optional transformer and rectifier.

Abstract: The invention is a fluid distillation apparatus (10) which, in its preferred embodiment, includes a cylindrical portion (12) which mates with an end wall (14) and a bell portion (16) to form an enclosed volume (18) within which evaporization and condensation of a selected fluid may take place. A heat exchange rotor assembly (20) is formed of head conductive material and includes intertwined evaporization and condensation channels (52, 54) in spiral array. A central tunnel (58) provides access for vapor from an evaporization volume (24) to a condensation volume (26) with a pressure gradient provided by an impeller (100) urging such passage. A drum motor (68) rotates the drum (40) to facilitate liquid flow in the heat exchange rotor (20). An impure fluid input port (32) and output ports are provided for purified fluid (34), concentrated brine (36) and degassing purposes (38).