Abstract: A method and apparatus for connecting a die having active circuitry to a substrate in semiconductor applications and in thermal inkjet printer applications where the die is directly bonded and sealed to the substrate without the need for conventional TAB circuit. Each die includes a back-side and a front-side, where the active circuitry is positioned, with at least one through-hole formed between the front-side and the back-side of the die. Each through-hole on the die is aligned with a corresponding conductive trace on the substrate. A conductive member is inserted within each through-hole. One end of the conductive member is electrically connected to a trace on the substrate. The other end of the conductive member is inserted into the through-hole such that the conductive member is positioned through the die and is exposed at the front-side of the die to contact an interconnect pad, which is electrically connected to the active circuitry on the die.

Abstract: A method and apparatus for connecting a die having active circuitry to a substrate in semiconductor applications and in thermal inkjet printer applications where the die is directly bonded and sealed to the substrate without the need for conventional TAB circuit. Each die includes a back-side and a front-side, where the active circuitry is positioned, with at least one through-hole formed between the front-side and the back-side of the die. Each through-hole on the die is aligned with a corresponding conductive trace on the substrate. A conductive member is inserted within each through-hole. One end of the conductive member is electrically connected to a trace on the substrate. The other end of the conductive member is inserted into the through-hole such that the conductive member is positioned through the die and is exposed at the front-side of the die to contact an interconnect pad, which is electrically connected to the active circuitry on the die.