Patents by Inventor Jay Gagnon

Jay Gagnon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200355525
    Abstract: Methods and apparatus for sensor including a die, a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface, lead fingers to provide electrical connections to the leadframe and to the die; and a component electrically coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of the IC package. The leadframe may have a cutout region in which the component is positioned.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: Allegro MicroSystems, LLC
    Inventors: William P. Taylor, Nirmal Sharma, Virgil Ararao, Leonardo Magpantay, Raymond W. Engel, Kirsten Doogue, Jay Gagnon
  • Patent number: 9228860
    Abstract: Methods and apparatus for a magnetic field sensor in a molded IC package having a magnetic field sensing element in a die with a component coupled to a leadframe at a downset area. In embodiments, a thickness of the leadframe in the downset area is less than a thickness of the leadframe in a non-downset area adjacent to the downset area.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: January 5, 2016
    Assignee: Allegro Microsystems, LLC
    Inventors: Nirmal Sharma, Virgil Ararao, Leonardo T. Magpantay, Raymond W. Engle, William P. Taylor, Kirsten Doogue, Jay Gagnon
  • Publication number: 20150285874
    Abstract: Methods and apparatus for a sensor having a die supporting a magnetic field sensor element, a leadframe having opposed first and second surfaces and leadfingers, a passive component coupled to the first and second ones of the leadfingers such that the component is an integrated part of an IC package, and a magnet adjacent to the second surface of leadframe to back bias the magnetic field sensor element.
    Type: Application
    Filed: June 17, 2015
    Publication date: October 8, 2015
    Applicant: ALLEGRO MICROSYSTEMS, LLC
    Inventors: William P. Taylor, Virgil Ararao, Leonardo Magpantay, Raymond W. Engel, Nirmal Sharma, Kirsten Doogue, Jay Gagnon
  • Publication number: 20130264667
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 10, 2013
    Applicant: Allegro Microsystems, Inc.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John B. Sauber, William P. Taylor, Elsa Kam-Lum
  • Publication number: 20130267043
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 10, 2013
    Applicant: Allegro Microsystems, Inc.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John B. Sauber, William P. Taylor, Elsa Kam-Lum
  • Patent number: 8486755
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: July 16, 2013
    Assignee: Allegro Microsystems, LLC
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Patent number: 8461677
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: June 11, 2013
    Assignee: Allegro Microsystems, LLC
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Publication number: 20120086090
    Abstract: Methods and apparatus provide a sensor including a component coupled to the leadframe such that the component is an integrated part of the IC package.
    Type: Application
    Filed: December 14, 2011
    Publication date: April 12, 2012
    Applicant: Allegro Microsystems, Inc.
    Inventors: Nirmal Sharma, Virgil Ararao, Leonardo T. Magpantay, Raymond W. Engel, William P. Taylor, Kirsten Doogue, Jay Gagnon
  • Publication number: 20120013333
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Applicant: ALLEGRO MICROSYSTEMS, INC.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Publication number: 20100141249
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: December 5, 2008
    Publication date: June 10, 2010
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Patent number: 7709754
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: May 4, 2010
    Assignee: Allegro Microsystems, Inc.
    Inventors: Michael Doogue, Richard Dickinson, Jay Gagnon
  • Publication number: 20080013298
    Abstract: Methods and apparatus provide a sensor having an integrated component coupled to a leadframe. In one embodiment, a sensor includes external leads on an opposite side of a die from the integrated component. In another embodiment, a leadframe includes a slot to reduce eddy currents.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 17, 2008
    Inventors: Nirmal Sharma, Virgil Ararao, Leonardo T. Magpantay, Raymond W. Engel, William P. Taylor, Kirsten Doogue, Jay Gagnon
  • Publication number: 20070279053
    Abstract: An integrated current sensor includes a current conductor, a magnetic field transducer, and an electromagnetic shield. The magnetic field transducer includes a sensor die. The electromagnetic shield is disposed proximate to the sensor die. The electromagnetic shield has at least one feature selected to reduce an eddy current in the electromagnetic shield.
    Type: Application
    Filed: July 11, 2007
    Publication date: December 6, 2007
    Inventors: William Taylor, John Cummings, Michael Doogue, Jay Gagnon, Vijay Mangtani, Nirmal Sharma
  • Patent number: 7166807
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited proximate to a surface of the substrate and proximate to the one or more magnetic field sensors.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: January 23, 2007
    Assignee: Allegro Microsystems, Inc.
    Inventors: Jay Gagnon, Richard Dickinson, Michael C. Doogue, Andreas P. Friedrich, William P. Taylor
  • Publication number: 20060219436
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.
    Type: Application
    Filed: May 12, 2006
    Publication date: October 5, 2006
    Inventors: William Taylor, Michael Doogue, Nirmal Sharma, Jay Gagnon, Vijay Mangtani
  • Patent number: 6995315
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: February 7, 2006
    Assignee: Allegro Microsystems, Inc.
    Inventors: Nirmal Sharma, Richard Dickinson, Michael Doogue, Jay Gagnon
  • Publication number: 20050248336
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors.
    Type: Application
    Filed: May 27, 2005
    Publication date: November 10, 2005
    Inventors: Nirmal Sharma, Richard Dickinson, Michael Doogue, Jay Gagnon
  • Publication number: 20050224248
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited proximate to a surface of the substrate and proximate to the one or more magnetic field sensors.
    Type: Application
    Filed: June 3, 2005
    Publication date: October 13, 2005
    Inventors: Jay Gagnon, Richard Dickinson, Michael Doogue, Andreas Friedrich, William Taylor
  • Publication number: 20050045359
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity.
    Type: Application
    Filed: August 26, 2003
    Publication date: March 3, 2005
    Inventors: Michael Doogue, Richard Dickinson, Jay Gagnon
  • Patent number: 6265865
    Abstract: A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die attach pad on which the sensor is secured and an assembly having one or more projections for securing the magnet in close proximity to the sensor. The leadframe is made from a metal having sufficient spring tension so that the assembly having the projections will secure the magnet. The sensor is adjacent to a ferromagnetic object and will detect a change in magnetic field caused by the ferromagnetic object. Only a thin layer of the plastic package covers the sensor thus reducing the distance between the sensor and the ferromagnetic object but still maintaining an air gap between the plastic package and the ferromagnetic object sufficient to allow passage of the ferromagnetic object.
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: July 24, 2001
    Assignee: Allegro Microsystems, Inc.
    Inventors: Raymond W Engel, Ravi Vig, Jay Gagnon J Gagnon