Patents by Inventor Jay H. EIGER

Jay H. EIGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10806937
    Abstract: An implantable medical device that includes electrical circuitry for providing a therapy to a patient. The device also includes a housing forming an inner chamber that is adapted for receiving, at least a portion of the electrical circuitry. The device further includes a thermally conductive material that is configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component. The thermally conductive material is a discrete component separate from the electrical circuitry and the housing.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: October 20, 2020
    Assignee: CIRTEC MEDICAL CORP.
    Inventor: Jay H. Eiger
  • Publication number: 20180264275
    Abstract: An implantable medical device that includes electrical circuitry for providing a therapy to a patient. The device also includes a housing forming an inner chamber that is adapted for receiving, at least a portion of the electrical circuitry. The device further includes a thermally conductive material that is configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component. The thermally conductive material is a discrete component separate from the electrical circuitry and the housing.
    Type: Application
    Filed: May 21, 2018
    Publication date: September 20, 2018
    Inventor: Jay H Eiger
  • Patent number: 9981137
    Abstract: An implantable medical device that includes electrical circuitry for providing a therapy to a patient. The device also includes a housing forming an inner chamber that is adapted for receiving, at least a portion of the electrical circuitry. The device further includes a thermally conductive material that is configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component. The thermally conductive material is a discrete component separate from the electrical circuitry and the housing.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: May 29, 2018
    Assignee: Nuvectra Corporation
    Inventor: Jay H Eiger
  • Patent number: 9138586
    Abstract: A contact block for electrically connecting a medical device to a conductive pin using improved electrical contact components. More specifically, an electrical contact block for achieving electrical contact with a conductive portion of an in-line IPG pin by utilizing a plurality of spherical conductive contact structures arranged in a ring around the conductive portion of the pin and biased toward the pin and held in place using a compliant o-ring.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: September 22, 2015
    Assignee: GREATBATCH LTD.
    Inventor: Jay H. Eiger
  • Publication number: 20130197608
    Abstract: An implantable medical device that includes electrical circuitry for providing a therapy to a patient. The device also includes a housing forming an inner chamber that is adapted for receiving, at least a portion of the electrical circuitry. The device further includes a thermally conductive material that is configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component. The thermally conductive material is a discrete component separate from the electrical circuitry and the housing.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 1, 2013
    Applicant: GREATBATCH, LTD.
    Inventor: Jay H. EIGER
  • Publication number: 20130197603
    Abstract: A contact block for electrically connecting a medical device to a conductive pin using improved electrical contact components. More specifically, an electrical contact block for achieving electrical contact with a conductive portion of an in-line IPG pin by utilizing a plurality of spherical conductive contact structures arranged in a ring around the conductive portion of the pin and biased toward the pin and held in place using a compliant o-ring.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 1, 2013
    Applicant: GREATBATCH, LTD.
    Inventor: Jay H. EIGER