Patents by Inventor Jay Harrington

Jay Harrington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of providing variant fills in semiconductor trenches
    Patent number: 6410402
    Abstract: Disclosed is a method of providing variant fills in a semiconductor substrate having a plurality of trenches by providing a semiconductor substrate with a first set of trenches and a second set of trenches, filling all the trenches with a first fill material, masking the second set of trenches in a manner effective in resisting an etching of said first fill material, etching the first fill material in the first set of trenches to a depth effective in permitting the first set of trenches to be plugged, plugging the first set of trenches with a material resistant to an etching of the first fill material, etching the first fill material from the second set of trenches; and then filling the second set of trenches with a second fill material. The process may be generalized to more than two fill materials.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: June 25, 2002
    Assignee: International Business Machines Corporation
    Inventors: Jay Harrington, Liang-Kai Han