Abstract: An electronic device including a frame having a front frame wall and a front panel assembly. The front frame wall is grounded and is parallel to the front panel assembly (FPA). The front panel assembly has a printed circuit board (PCB) on an interior side of it and PCB includes a ground contact. A detachable ground clip is attached to the front frame wall and has a protruding flexible arm that is configured to engage the ground contact of the PCB when the FPA is positioned for assembly. The central contact portion contacts or engages the ground contact on the PCB, and includes a visual indicator means integrated into the distal end and the front frame wall such that an observer looking at the interior side of the front frame wall can visually confirmed the central contact engagement with the ground contact of the printed circuit board.

Abstract: An electronic device such as a set top box is provided that includes a frame having flat bottom; a flat circuit board generally parallel to the flat bottom in which the flat circuit board has at least one aperture; at least one boss that extends from the flat bottom and extends through the at least one aperture in which the at least one boss has a screw receiving aperture; and an electronic component such as a hard drive or smart card assembly over the circuit board and electrically connected to the circuit board in which the electronic component has at least one screw to fasten the electronic device to the boss. The electronic component is supported by the bosses and not supported by the flat circuit board.

Abstract: The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.

Abstract: At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.

Abstract: An electronic device including a frame having a front frame wall and a front panel assembly. The front frame wall is grounded and is parallel to the front panel assembly (FPA). The front panel assembly has a printed circuit board (PCB) on an interior side of it and PCB includes a ground contact. A detachable ground clip is attached to the front frame wall and has a protruding flexible arm that is configured to engage the ground contact of the PCB when the FPA is positioned for assembly. The central contact portion contacts or engages the ground contact on the PCB, and includes a visual indicator means integrated into the distal end and the front frame wall such that an observer looking at the interior side of the front frame wall can visually confirmed the central contact engagement with the ground contact of the printed circuit board.

Abstract: A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down.

Abstract: An electronic device is provided that comprises a bottom frame portion; an information card reader over the bottom frame portion; a thermal insulation layer; a circuit board over the thermal insulation layer; a top broad heat sink over the circuit board; and a top cover over the top broad heat sink.

Abstract: A rubber foot assembly and embossed mounting assembly for supporting a structure is provided that comprise: an aperture formed along a lower wall of the structure and a rubber foot engaged in the aperture, wherein the rubber foot has a flexible contoured bottom portion connected to a top portion through a neck portion. The neck region is adapted to freely slide vertically along a wall of the aperture such that a peripheral region of the flexible contoured bottom portion contacts a portion of the embossed mounting assembly, thereby supporting the structure. A plurality of the rubber foot assemblies and embossed mounting assemblies can be incorporated into the structure, which can be a set-top box, to prevent the structure from rocking on uneven surfaces.

Abstract: A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along the first vertical side wall; and a second heatsink contacting the second heat source element, wherein the second heatsink is located in only one half of the device and is aligned with the second vent. The multiple heatsinks and associated vents work in concert to improve heat dissipation.

Abstract: A passive cooling arrangement for an electronic housing assembly is disclosed which comprises a frame disposed in the housing assembly; a circuit board supported in the frame; a heat generating component disposed on the circuit board; and a heat sink configured with a substantially flat peripheral portion and a depression portion, the substantially flat peripheral portion facing and being nearly coextensive with an outer wall of said housing assembly, and the depression portion being in thermal engagement with the heat generating component on the circuit board, whereby heat generated by the heat generating component can be passively thermally conducted through the depression portion and into the substantially flat peripheral portion of the heat sink, and thereafter dissipated in a generally uniform manner through the outer wall of the housing assembly.

Abstract: An RF interference suppressor for satellite receivers and more specifically those that employ the MOCA standard is provided. The RF interference suppressor shields the connection point of the center conductor of the F-connector to the PC board from spurious signals emanating from the high speed digital portions of the receiver. In addition, the RF interference suppressor shield includes a tab portion that encompasses the threaded portion of the F-connector and operates to shield the path for RF interference resulting from the gap between the F-connector body and the inner shield wall of the receiver.

Abstract: The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.