Abstract: A semiconductor device includes a lead frame assembly having a die attach pad with a die secured by a die bonding material. A portion of the die bonding material may flow out from between the die and the die attach pad to form a squash out layer. A raised bond pad is at least partially in the squash out layer area and extends upward from said die attach pad sufficient to be above the squash out layer. A bond wire has one end secured to a ground terminal on the die and the other end to the raised bond pad. The whole structure is encapsulated in a plastic package.

Abstract: The lead-frame in an integrated circuit package, a standard package designated SOT-89, has a plurality of leads of which at least one is an extension of a die-attach pad. At least one ground wing is formed as an extension of a peripheral portion of the die-attach pad and extends upward to approximately the plane of the top of the die. The ground wing has an upstanding portion and a horizontal portion that are at an angle to each other so as to lock the distal end of the wing in the body of encapsulating resin. An integrated circuit die having at least one electrical connection which is grounded electrically via a terminal and wire bonded to the distal part of the ground wing. A contact surface near the distal end of wing is positioned approximately in the plane of the top of the die. This ground circuit can parallel and can be redundant to a ground circuit through the die via the conductive bond that attaches the bottom of the die to the die-attach pad.

Abstract: A uniformly thick dielectric polyimide coating is provided on the back face of an integrated circuit and the die is mounted to a copper lead frame finger by interposing an epoxy resin bonding agent between the uniformly thick polyimide coating and the copper support finger. The die coating is provided before separating die from the precursive water. Liquid polyimide is poured onto the back side of the water which is spun, in a manner similar to that usually used for obtaining uniformly thick photoresist films. After curing the polyimide, the die are cut from the wafer by sawing.

Abstract: The lead-frame in an integrated circuit package, a dual-inline-package (DIP), has a plurality of leads of which four are extensions of a down-set die-attach pad. A dog-leg finger lines in the plane of the leads and is an extension of a peripheral portion of the die-attach pad. The dog-leg finger has first and second parts that are at right angles to each other so as to lock a distal port of it in the body of encapsulating resin. An integrated circuit die having at least one power transistor is grounded electrically via a terminal and wire bonded to the distal part of the dog-leg finger. This ground circuit parallels and is redundant to a ground circuit through the die via the conductive resin that attaches the bottom of the die to the die-attach pad, the later circuit having a relatively high electrical resistance. The four leads that are extensions of the die-attach pad serve both to remove heat from the die and to provide an electrical ground connection.