Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode, and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a chamber clean mode. Numerous other embodiments are provided.

Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode, and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a chamber clean mode. Numerous other embodiments are provided.

Abstract: An electronic device manufacturing system is provided that may reduce the amount of resources used in electronic device manufacturing processes. In some embodiments, unreacted ozone exiting a process tool operating in an ozone mode may be diverted and used as an oxidant in an abatement tool when the process tool is operating in a non-ozone mode. Numerous other embodiments are provided.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: Methods and apparatus for enhanced control, monitoring and recording of incoming chemical and power use, and emissions of electronic device manufacturing systems are provided. In some embodiments, integrated sub-fab system systems may monitor the energy usage of the sub-fab equipment. The tool can enter many different depths of energy savings modes such as idle (shallow energy savings where production equipment can recover to normal production with no quality or throughput impact in seconds), sleep (deeper energy savings where production equipment can recover in minutes), or hibernate (where production equipment may require hours to recover not to have impact on quality, or throughput) for the system. In some embodiments, the system may monitor and display all gas emissions in a sub-fab as well as the Semi S23 method reporting of CO2 equivalent emission. The system may monitor effluent process gases and energy use from the process tool and sub-fab equipment.

Abstract: A method for operating an electronic device manufacturing system is provided that includes introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode; and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a clean mode. Numerous other embodiments are provided.

Abstract: A method for operating an electronic device manufacturing system is provided, including: introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode; and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a clean mode. Numerous other embodiments are provided.

Abstract: A method for abating effluent from an electronic device manufacturing process is provided, including abating the effluent in a thermal abatement tool to form abated effluent; determining whether the abated effluent contains one or more chemical species of interest; and changing one or more operating parameters of the thermal abatement tool based upon the determination. Numerous other embodiments are provided.

Abstract: A method for operating one or more electronic device manufacturing systems is provided, including the steps 1) performing a series of electronic device manufacturing process steps with a process tool, wherein the process tool produces effluent as a byproduct of performing the series of process steps; 2) abating the effluent with an abatement tool; 3) supplying an abatement resource to the abatement tool from a first abatement resource supply; 4) changing an abatement resource supply from the first abatement resource supply to a second abatement resource supply, wherein changing the abatement resource supply comprises: i) interrupting a flow of the abatement resource from the first abatement resource supply; and ii) beginning a flow of the abatement resource from the second abatement resource supply; and 5) continuing to perform the series of process steps with the process tool, while changing, and after changing, the abatement resource supply.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: A flame sensor apparatus for use with a flame heated thermal abatement reactor is provided, including a flame sensor adapted to sense a flame within the thermal abatement reactor; and a shutter adapted to selectively block the transmission of radiation from the flame to the flame sensor.

Abstract: The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

Abstract: Methods and apparatus for enhanced control, monitoring and recording of incoming chemical and power use, and emissions of electronic device manufacturing systems are provided. In some embodiments, integrated sub-fab system systems may monitor the energy usage of the sub-fab equipment. The tool can enter many different depths of energy savings modes such as idle (shallow energy savings where production equipment can recover to normal production with no quality or throughput impact in seconds), sleep (deeper energy savings where production equipment can recover in minutes), or hibernate (where production equipment may require hours to recover not to have impact on quality, or throughput) for the system. In some embodiments, the system may monitor and display all gas emissions in a sub-fab as well as the Semi S23 method reporting of CO2 equivalent emission. The system may monitor effluent process gases and energy use from the process tool and sub-fab equipment.

Abstract: Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, an integrated sub-fab system in accordance with the present invention may be provided with fixed or real time power factor management, correction, reporting, and tabulation. Such a system could also be used by any industry consuming significant levels of power. The integrated sub-fab system power management could be extended to other parts of the factory where high levels of power are used.

Abstract: Methods and apparatus for treating effluents in process systems are provided In some embodiments, a system for treating effluent includes a process chamber having a processing volume; an exhaust conduit coupled to the process chamber to remove an effluent from the processing volume; and a reactive species generator coupled to the exhaust conduit to inject a reactive species into the exhaust conduit to treat the effluent, wherein the reactive species generator generates a reactive species comprising at least one of singlet hydrogen, hydrogen ions or hydrogen radicals. In some embodiments, a method for treating effluent includes flowing an effluent from a processing volume of a process system through an exhaust conduit fluidly coupled to the processing volume; treating the effluent in the exhaust conduit with a reactive species comprising at least one of singlet hydrogen, hydrogen ions, or hydrogen radicals; and flowing the treated effluent to an abatement system.

Abstract: Embodiments of an abatement apparatus are disclosed herein. In some embodiments, an abatement apparatus may include a scrubber configured to receive an effluent stream from a process chamber and further configured to remove first particles from the effluent stream; a scrubber conduit coupled to the scrubber to receive the effluent stream therefrom and configured to remove second particles from the effluent stream, the scrubber conduit having one or more inlets configured to provide a fluid to sufficiently wet an interior surface of the scrubber conduit to trap the second particles thereon and to wash the second particles therealong; and a central scrubber coupled to the scrubber via the scrubber conduit. In some embodiments, the scrubber conduit is downward sloping from the scrubber to the central scrubber. In some embodiments, a plurality of scrubbers may be coupled to the central scrubber via a plurality of scrubber conduits.

Abstract: The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

Abstract: The present invention relates to a thermal reactor apparatus used to treat industrial effluent fluids, for example waste effluent produced in semiconductor and liquid crystal display manufacturing processes. Specifically, the present invention relates to improved monitoring and control features for the thermal reactor apparatus, including a flame sensing device, an intrinsically safe flammable gas sensing device, and a sequential mode of operation having built-in safety redundancy. The improved monitoring and control features ensure the safe and efficient abatement of waste effluent within the thermal reactor apparatus.

Abstract: A method for operating an electronic device manufacturing system is provided, including: introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode; and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a clean mode. Numerous other embodiments are provided.

Abstract: In one aspect, a method of forming a silicon layer on a substrate is provided, including the steps providing a substrate; and introducing hydrogen and silane into a chamber containing the substrate such that a layer of silicon is deposited on the substrate; wherein the silane is less than about 99.999% pure. Numerous other aspects are provided.