Abstract: A flexible printed circuit board assembly having an integrated circuit die bonded directly thereto. A first layer of the flexible printed circuit board assembly includes a plurality of conductive paths and geometrical patterns on each of its surfaces. The conductive patterns include pads for mounting the integrated circuit die and connecting the wires from the integrated circuit. Additional intermediate layers of the flexible printed circuit board assembly, having an aggregate thickness greater than the height of the integrated circuit die and associated leads bonded thereto, surround the integrated circuit die. The top layer of the flexible printed circuit board provides for total encapsulation of the integrated circuit die for protection thereof. In the preferred embodiment that portion of the top layer which covers the integrated circuit die is opaque to prevent the passage of ultraviolet light which might otherwise cause damage to the integrated circuit.

Abstract: A double-sided flexible electronic circuit module is provided having a flexible printed circuit board. The flexible circuit board has a plurality of conductive paths on each surface and a plurality of conductively plated-through apertures being connected to the conductive paths. One side of the flexible circuit board is adapted to carry components with leads; the other side of the flexible circuit board is adapted to receive components without leads. A carrier member, larger than the flexible circuit board and of a size and shape sufficient to accommodate the placement of at least one flexible circuit board, is also provided. The carrier member has a plurality of apertures which are in alignment with the apertures of the flexible circuit board, and a plurality of elongated slots in predetermined positions which extend the entire width of the flexible circuit board which is temporarily affixed onto the carrier member.

Abstract: An improved header and housing assembly for holding a miniaturized electronic circuit module having a plurality of leads includes a header member having a plurality of apertures arranged to accept the leads of the module. A jaw mechanism associated with each aperture captivates the leads and a protective housing encloses the module between the header member and the housing. An interconnection board which is mounted to a flexible printed circuit board engages the header and housing assembly and forms a base permitting the assembly to be mounted to the flexible circuit board.

Abstract: The integral interconnect socket and flexible board assembly accepts an electronic module having a plurality of leads arranged in a predetermined pattern. The assembly includes a flexible printed circuit (PC) board having a plurality of conductors and a first set of holes disposed to respectively intersect the conductors. A substantially rigid platform is mounted to the PC board and has a second set of holes. The first and second set of holes are in alignment and define common apertures arranged in the predetermined pattern to receive the leads of the modules. A layer of metal plating formed within the apertures makes electrical connections with the respective conductors. Jacks are mounted to each aperture for receiving the leads and making electrical connections between the leads and the conductors.