Patents by Inventor Jay Jui Hsiang Liu

Jay Jui Hsiang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and method of manufacturing same
    Patent number: 6897562
    Abstract: An electronic component includes an organic interposer (160, 460, 560, 660, 760, 860, 960), a semiconductor chip (220) mounted over the organic interposer, copper pads (250, 751, 851) under the organic interposer, a solder attachment (110, 510, 610, 910) between certain ones of the copper pads, and solder interconnects (120, 420) between certain other ones of the copper pads and located around an outer perimeter (111, 511, 911) of the solder attachment. The solder attachment is placed at locations within the electronic component that experience the greatest stress, which may include, for example, locations adjacent to at least a portion of a perimeter (221) of the semiconductor chip. In one embodiment, a surface area of the solder attachment is larger than a surface area of each one of the solder interconnects. In the same or another embodiment, the electronic component includes multiple solder attachments.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: May 24, 2005
    Assignee: Motorola Corporation
    Inventors: Lei L. Mercado, Tien-Yu Tom Lee, Jay Jui Hsiang Liu
  • Electronic component and method of manufacturing same
    Publication number: 20040201106
    Abstract: An electronic component includes an organic interposer (160, 460, 560, 660, 760, 860, 960), a semiconductor chip (220) mounted over the organic interposer, copper pads (250, 751, 851) under the organic interposer, a solder attachment (110, 510, 610, 910) between certain ones of the copper pads, and solder interconnects (120, 420) between certain other ones of the copper pads and located around an outer perimeter (111, 511, 911) of the solder attachment. The solder attachment is placed at locations within the electronic component that experience the greatest stress, which may include, for example, locations adjacent to at least a portion of a perimeter (221) of the semiconductor chip. In one embodiment, a surface area of the solder attachment is larger than a surface area of each one of the solder interconnects. In the same or another embodiment, the electronic component includes multiple solder attachments.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 14, 2004
    Applicant: Motorola, Inc.
    Inventors: Lei L. Mercado, Tien-Yu Tom Lee, Jay Jui Hsiang Liu