Abstract: Multi-layer films particularly suited for packaging applications, including a core layer, a tie layer made from at least 10 wt % of a first polymer and where the first polymer preferably is not present in the core layer are provided. Optionally, the multi-layer film may have a skin layer, a second tie layer and/or a second skin layer. Embodiments may have the advantage of improved seal strength, hermeticity, hot tack and reduced-temperature sealability.

Abstract: Multi-layer films particularly suited for packaging applications, including a core layer, a tie layer made from at least 10 wt % of a first polymer and a service layer, wherein the tie layer is a sealable layer and may provide a hermetic seal when sealed to itself. The films of this invention may be suitable for use in preparing hermetically sealed packages. Optionally, the multi-layer film may have a skin layer and/or a second skin layer. Embodiments may have the advantage of improved seal strength, hermeticity, hot tack, reduced-temperature sealability, and improved packaging machine operating speed.

Abstract: An oriented, heat-sealable polypropylene film is provided which possesses a low coefficient of friction, excellent anti-static behavior and good optical clarity.

Abstract: Multi-layer structures, such as films of low coefficient of friction also having antistick characteristics over a wide temperature range during heat-sealing are disclosed. In accordance with a preferred embodiment, the films comprise an amide-containing polypropylene base layer and two heat sealable skin layers of a low stereoregularity polyolefin and microcrystalline wax. Methods for forming such structures are also disclosed.