Abstract: Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected.

Abstract: Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected.

Abstract: Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected.

Abstract: Provided is an apparatus and method to control fan noise in a computer server room. An exemplary apparatus includes one or more transducers coupled to one or more walls of a plurality of system racks and one or more active noise control units, wherein the one or more active noise control units send control signals to the one or more transducers to emit a transducer acoustic wave. It also includes a microphone installed near a location in the computer server room where cooling fan noise needs to be controlled, wherein the microphone collects fan noise signals emitted from running fans on the plurality of system racks in the computer server room and sends the collected fan noise signals to the one or more active noise control units to allow the frequency and intensity of the transducer acoustic wave to be substantially equal to a frequency and an intensity of the fan noise and at about 180 degrees out of phase with the fan noise to reduce or to eliminate the fan noise.

Abstract: Various embodiments of a heat sink assembly are disclosed. In one embodiment, the heat sink assembly includes a processor mounted onto a circuit board; a heat sink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heat sink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heat sink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heat sink, counter directional to the bias from the load spring.

Abstract: In some embodiments, an electronics assembly may include a frame with a motherboard and a plurality of daughterboards. The frame may have an opening opposite the motherboard to allow insertion of the daughterboards into the frame or removal of the daughterboards from the frame. An injector/ejector mechanism for each daughterboard may be located on the daughterboard or the frame. The frame may further include a flange that extends along the frame at or adjacent to the opening and on which the injector/ejector mechanism of each daughterboard is attached or engages at different locations along the length thereof. The flange may be divided into separate sections that correspond to the different locations to allow the flange to flex at any location along the frame during insertion of a daughterboard without the flexing affecting the position of any adjacent location of the flange with respect to the motherboard.

Abstract: An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the enclosure. One or more fans may be provided for maintaining a through flow of air for cooling the components of the assembly. The heat-generating components are located within the enclosure in line with the direction of the flow of air, and the heat-sinks have a configuration such that the air flows over them in parallel. The heat-sinks may each have a flat base for mounting on the component, and a cantilevered portion having one end located on the base, and another end that extends beyond the base and over the base of the other heat-sink, but not in contact with it.

Abstract: There is provided a computing apparatus. The computing apparatus has first and second computing elements and a heatsink thermally coupled to each of the first and second computing elements. A portion of the heatsink thermally coupled to the first computing element is thermally separated from a portion of the heatsink thermally coupled to the second computing element by a region having a reduced thermal conductivity.

Abstract: A chassis for an electronics assembly comprises: (i) a frame (1); and (ii) a panel (31) located on a face of the frame, the panel comprising a plurality of cooling fans (22) and a holder (30) for the fans. The panel allows removal of individual fans from the panel and replacement of any fans while the panel is located on the frame, and the frame allows removal of the panel therefrom and replacement of the panel. The chassis thus allows replacement of any fans without the assembly being shut down, and also reduces downtime of the assembly if all the fans need replacing, for example for maintenance.

Abstract: A support for holding an electronics assembly, comprises: (i) a rigid frame (6) that can be secured to the assembly; (ii) one or more cushioning elements (8) for protecting an electronics assembly held by the support against mechanical shocks during handling; and (iii) a plurality of handles (16) to enable the support to be manually lifted. The handles may be employed to lift both the assembly and the support, or they may be used to release the support from the assembly once the assembly is in place in an electronics cabinet. The support protects the assembly during installation in data centres after other packing materials have been discarded.

Abstract: A chassis for an electronic system. The chassis includes a recess therein for housing a plurality of cooling fans that are arranged in series and can be removed from the recess by sliding out of the recess in a direction across the direction of intended airflow. The assembly is arranged such that any of the fans can be removed and replaced without interrupting operation of the or any other fan. The recess and/or the fans have a seal to prevent or reduce bypass leakage of air around the fans.

Abstract: An electromagnetic (EM) shielding assembly includes an electrically conductive shielding portion and one or more electrically conductive protrusions for engaging with respective conductive apertures in a circuit board. The electrically conductive protrusions can be in electrical communication with the EM shielding portion. The protrusions can enable the EM shielding assembly to be attached to a circuit board in a computer system while also providing an electrical connection to logical ground. Further components, for example a heat sink that may be in electrical communication with the EM shielding portion, may thereby also be connected to logical ground.

Abstract: An electronics assembly comprises a frame (1) that contains a motherboard (8) and a plurality of daughterboards (10).

Abstract: There is provided a heatsink assembly. The heatsink assembly comprises: a processor mounted onto a circuit board; a heatsink located in thermal contact with the processor at the side of the processor opposite circuit board; and an electromagnetic shielding member located between the circuit board and the heatsink. The electromagnetic shielding member is releasably attached to the circuit board. Additionally, or in the alternative, the heatsink is biased toward the processor by a load spring and the electromagnetic shielding member is configured to provide a spring force between the circuit board and the heatsink, counter directional to the bias from the load spring.

Abstract: An electronics assembly comprises a frame (1) that contains a motherboard (8) and a plurality of daughterboards (10). The frame has an opening opposite the motherboard to allow insertion of the daughterboards into the frame or removal of the daughterboards from the frame. The frame also has an injector/ejector mechanism (16, 18) for each daughterboard that is located on the daughterboard or the frame and a flange (28) that extends adjacent to the opening and on which the injector/ejector mechanism of each daughterboard is attached or engages at different locations along the length thereof. The flange (28) is divided into separate sections (30) that correspond to the different locations to allow the flange to flex at any adjacent location during insertion of a daughterboard without the flexing affecting the position of any adjacent location of the flange with respect to the motherboard.

Abstract: A support for holding an electronics assembly, comprises:

Abstract: An electronics assembly comprises a frame (1) that contains a motherboard (8) and a plurality of daughterboards (10).

Abstract: An electronics assembly for example a computer, comprises a chassis (1) having a recess therein for housing a plurality of cooling fans (30) that are arranged in series and can be removed from the recess by sliding out of the recess in a direction across the direction of intended airflow. The assembly is such that any of the fans (30) can be removed and replaced without interrupting operation of the or any other fan, and the recess and/or the fans have a seal (40, 54) to prevent or reduce bypass leakage of air around the fans.

Abstract: A chassis for an electronics assembly comprises: