Patents by Inventor Jay Kin Ming Keung

Jay Kin Ming Keung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090136698
    Abstract: Multi-layer films particularly suited for packaging applications, including a core layer, a tie layer made from at least 10 wt % of a first polymer and a service layer, wherein the tie layer is a sealable layer and may provide a hermetic seal when sealed to itself. The films of this invention may be suitable for use in preparing hermetically sealed packages. Optionally, the multi-layer film may have a skin layer and/or a second skin layer. Embodiments may have the advantage of improved seal strength, hermeticity, hot tack, reduced-temperature sealability, and improved packaging machine operating speed.
    Type: Application
    Filed: January 30, 2009
    Publication date: May 28, 2009
    Inventors: Richard Alan Rehkugler, Richard John Schoonerman, Jay Kin Ming Keung