Patents by Inventor Jay Leonard Kelly

Jay Leonard Kelly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density wirebond connector assembly
    Patent number: 6309224
    Abstract: A high density wirebond connector assembly (10), including an enclosure (12), a circuit board (14), a high density connector (16), a connector housing (18), and a plurality of nail contacts (20). The circuit board (14) is comprised of a plurality of laminate layers (26) and rows of wirebond pads (28) positioned on the laminate layers (26). A plurality of wirebonds (32) run between individual nail contacts (20) and individual wirebond pads (28). By increasing the density of the high density connector (16), and decreasing the distance between the wirebond pads (28) and the nail contacts (20), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly (10) is provided.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: October 30, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Daniel Alan Lawlyes, Jay Leonard Kelly, Anthony Raschilla