Patents by Inventor Jay Maghirang

Jay Maghirang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System in package manufacturing method using wafer-to-wafer bonding
    Patent number: 8822267
    Abstract: Embodiments of the present disclosure are related to manufacturing system-in-packages at wafer-level. In particular, various embodiments are directed to adhering a first wafer to a second wafer and adhering solder balls to contact pads of the first wafer. In one embodiment, a first wafer having first and second surfaces is provided. The first wafer includes bond pads located on the first surface that are coupled to a respective semiconductor device located in the first wafer. A second wafer having an electrical component located therein is provided. A conductive adhesive is provided on at least one of the first wafer and the second wafer. Conductive balls are provided on the bond pads on the first surface of the first wafer. The conductive balls and the conductive adhesive are heated to cause the conductive balls to adhere to the bond pad and the conductive adhesive to adhere the first wafer to the second wafer.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: September 2, 2014
    Assignee: STMicroelectronics Pte Ltd.
    Inventors: How Yuan Hwang, Jay Maghirang, Yaohuang Huang, Kim-Yong Goh, Phone Maw Hla, Edmond Soon
  • SYSTEM IN PACKAGE MANUFACTURING METHOD USING WAFER-TO-WAFER BONDING
    Publication number: 20140113410
    Abstract: Embodiments of the present disclosure are related to manufacturing system-in-packages at wafer-level. In particular, various embodiments are directed to adhering a first wafer to a second wafer and adhering solder balls to contact pads of the first wafer. In one embodiment, a first wafer having first and second surfaces is provided. The first wafer includes bond pads located on the first surface that are coupled to a respective semiconductor device located in the first wafer. A second wafer having an electrical component located therein is provided. A conductive adhesive is provided on at least one of the first wafer and the second wafer. Conductive balls are provided on the bond pads on the first surface of the first wafer. The conductive balls and the conductive adhesive are heated to cause the conductive balls to adhere to the bond pad and the conductive adhesive to adhere the first wafer to the second wafer.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 24, 2014
    Applicant: STMICROELECTRONICS PTE LTD.
    Inventors: How Yuan Hwang, Jay Maghirang, Yaohuang Huang, Kim-Yong Goh, Phone Maw Hla, Edmond Soon