Patents by Inventor Jay Meyer

Jay Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12269399
    Abstract: An accessory attachment system includes a baseplate that provides an attachment interface on a vehicle. The baseplate is configured to engage with an accessory to secure the accessory to the vehicle. The baseplate and the accessory are configured to electrically connect to each other through an electrical contact interface.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: April 8, 2025
    Assignee: Ford Global Technologies, LLC
    Inventors: Galen Keith Thomas, Michael Azzouz, Jay Meyer
  • Publication number: 20230115236
    Abstract: An accessory attachment system includes a baseplate that provides an attachment interface on a vehicle. The baseplate is configured to engage with an accessory to secure the accessory to the vehicle. The baseplate and the accessory are configured to electrically connect to each other through an electrical contact interface.
    Type: Application
    Filed: April 8, 2022
    Publication date: April 13, 2023
    Inventors: Galen Keith Thomas, Michael Azzouz, Jay Meyer
  • Patent number: 11143838
    Abstract: An optical element retainer includes a ring body defined about a central axis. The ring body includes an inner diametric surface, an outer diametric surface opposed to the inner diametric surface, a first annular axial surface, and a plurality of flexures extending from a second annular axial surface opposite the first annular axial surface.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: October 12, 2021
    Assignee: N2 Imaging Systems, LLC
    Inventors: Darren M. Zack, Jay Meyer, Justin Jun, Scott Richman
  • Patent number: 11122698
    Abstract: An electronics assembly can include a circuit board comprising a stress sensitive device and a stiffening member operatively connected to the circuit board to stiffen the circuit board. The assembly can include a housing disposed around the circuit board and the stiffening member to contain circuit board and the stiffening member. The assembly can include one or more elastic and/or flexible bumpers disposed between the circuit board and the housing to provide shock absorption to the circuit board within the housing.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: September 14, 2021
    Assignee: N2 Imaging Systems, LLC
    Inventors: Darren M. Zack, Jay Meyer
  • Publication number: 20210193408
    Abstract: A button assembly is disclosed including a plastic cover having an upper body portion and a lower flange portion, the upper body portion having a top wall and an interior cavity, wherein a port is formed in the top wall of the upper body portion and the lower flange portion is adapted and configured to be welded to a wall of a plastic housing, and an elastomeric button over-molded on the plastic cover and including an upper actuation portion and a lower body portion, wherein the upper actuation portion extends through the port formed in the top wall of the upper body portion of the cover, and the lower body portion resides in the interior cavity of the upper body portion of the cover.
    Type: Application
    Filed: September 1, 2020
    Publication date: June 24, 2021
    Inventors: lliyan lliev, Jay Meyer
  • Patent number: 10796860
    Abstract: A button assembly is disclosed including a plastic cover having an upper body portion and a lower flange portion, the upper body portion having a top wall and an interior cavity, wherein a port is formed in the top wall of the upper body portion and the lower flange portion is adapted and configured to be welded to a wall of a plastic housing, and an elastomeric button over-molded on the plastic cover and including an upper actuation portion and a lower body portion, wherein the upper actuation portion extends through the port formed in the top wall of the upper body portion of the cover, and the lower body portion resides in the interior cavity of the upper body portion of the cover.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 6, 2020
    Assignee: N2 Imaging Systems, LLC
    Inventors: Iliyan Iliev, Jay Meyer
  • Publication number: 20200218029
    Abstract: An optical element retainer includes a ring body defined about a central axis. The ring body includes an inner diametric surface, an outer diametric surface opposed to the inner diametric surface, a first annular axial surface, and a plurality of flexures extending from a second annular axial surface opposite the first annular axial surface.
    Type: Application
    Filed: January 8, 2019
    Publication date: July 9, 2020
    Inventors: Darren M. Zack, Jay Meyer, Justin Jun, Scott Richman
  • Publication number: 20200194196
    Abstract: A button assembly is disclosed including a plastic cover having an upper body portion and a lower flange portion, the upper body portion having a top wall and an interior cavity, wherein a port is formed in the top wall of the upper body portion and the lower flange portion is adapted and configured to be welded to a wall of a plastic housing, and an elastomeric button over-molded on the plastic cover and including an upper actuation portion and a lower body portion, wherein the upper actuation portion extends through the port formed in the top wall of the upper body portion of the cover, and the lower body portion resides in the interior cavity of the upper body portion of the cover.
    Type: Application
    Filed: December 12, 2018
    Publication date: June 18, 2020
    Inventors: Iliyan Iliev, Jay Meyer
  • Publication number: 20200146161
    Abstract: An electronics assembly can include a circuit board comprising a stress sensitive device and a stiffening member operatively connected to the circuit board to stiffen the circuit board. The assembly can include a housing disposed around the circuit board and the stiffening member to contain circuit board and the stiffening member. The assembly can include one or more elastic and/or flexible bumpers disposed between the circuit board and the housing to provide shock absorption to the circuit board within the housing.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 7, 2020
    Inventors: Darren M. Zack, Jay Meyer
  • Publication number: 20200142176
    Abstract: A tube retainer can include a body configured to abut a face of a tube, a plurality of flexure flanges extending radially outwardly from the body and configured to flex relative to the body to provide a retaining force to the body when installed in a housing assembly around the tube, and a plurality of flexure legs axially extending from the body from a tube contact side of the body. At least a portion of the plurality of legs can include an inner diameter that is less than an outer diameter of the tube to provide a centering force to the tube.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 7, 2020
    Inventors: Darren M. Zack, Jay Meyer, Scott Richman
  • Publication number: 20070020920
    Abstract: A method for fabricating a low leakage integrated circuit structure. An antireflective layer is disposed without intervening layers directly onto the top of an interconnect conductor, and a dielectric layer is disposed over the antireflective layer. The interconnect conductor is aluminum; the antireflective layer is titanium nitride, and the antireflective layer has thickness less than or equal to 650 angstroms and greater than or equal to 150 angstroms. A contact window is opened with the contact window extending at least down to the antireflective layer.
    Type: Application
    Filed: September 22, 2006
    Publication date: January 25, 2007
    Inventors: Chintamani Palsule, Jay Meyer, John Stanback, Jeremy Theil, Mark Crook, Kirk Lindahl
  • Publication number: 20060099800
    Abstract: A method for fabricating a low leakage integrated circuit structure. An antireflective layer is disposed without intervening layers directly onto the top of an interconnect conductor, and a dielectric layer is disposed over the antireflective layer. The interconnect conductor is aluminum; the antireflective layer is titanium nitride, and the antireflective layer has thickness less than or equal to 650 angstroms and greater than or equal to 150 angstroms. A contact window is opened with the contact window extending at least down to the antireflective layer.
    Type: Application
    Filed: November 9, 2004
    Publication date: May 11, 2006
    Inventors: Chintamani Palsule, Jay Meyer, John Stanback, Jeremy Theil, Mark Crook, Kirk Lindahl