Patents by Inventor Jay Noble

Jay Noble has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12349240
    Abstract: Ovens for atomic clocks may include a body including a cavity within the body. A plurality of heating elements may be distributed around the body, each heating element of the plurality including coils of electrically resistive material. An arrangement of the plurality of heating elements may be such that far fields of magnetic fields having opposite polarities induced by respective coils of the heating elements overlap.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: July 1, 2025
    Assignee: Microchip Technology Incorporated
    Inventors: Lichung Ha, Jay Noble, David Guan, Armando T. Martins
  • Publication number: 20220039209
    Abstract: Ovens for atomic clocks may include a body including a cavity within the body. A plurality of heating elements may be distributed around the body, each heating element of the plurality including coils of electrically resistive material. An arrangement of the plurality of heating elements may be such that far fields of magnetic fields having opposite polarities induced by respective coils of the heating elements overlap.
    Type: Application
    Filed: October 4, 2021
    Publication date: February 3, 2022
    Inventors: Lichung Ha, Jay Noble, David Guan, Armando T. Martins
  • Patent number: 11166342
    Abstract: Ovens for atomic clocks may include a body including a cavity within the body. A plurality of heating elements may be distributed around the body, each heating element of the plurality including coils of electrically resistive material. An arrangement of the plurality of heating elements may be such that far fields of magnetic fields having opposite polarities induced by respective coils of the heating elements overlap.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: November 2, 2021
    Assignee: Microchip Technology Incorporated
    Inventors: Lichung Ha, Jay Noble, David Guan, Armando T. Martins