Abstract: A card cage having a series of circuit board slots may be modified using various components of a circuit board adapter. The card cage has a series of slots, each slot having common dimensions and including card guides adapted to house a full height circuit board card by holding a top end and a bottom end of the full height circuit board card. Each modified slot also includes a set of cooperating vertical support member guides located within the slot which cooperate to house the vertical support member within the slot by holding the top end and the bottom end thereof. The vertical support member supports an intermediate card guide which cooperates with at least one of the card guides to house a smaller circuit board within the slot by holding a top end and a bottom end therebetween. Thus, when the intermediate card guide is removed from the slot, a full vertical height circuit board card may be inserted within the slot.

Abstract: A card cage having a series of circuit board slots may be modified using various components of a circuit board adapter. The card cage has a series of slots, each slot having common dimensions and including card guides adapted to house a full height circuit board card by holding a top end and a bottom end of the full height circuit board card. Each modified slot also includes a set of cooperating vertical support member guides located within the slot which cooperate to house the vertical support member within the slot by holding the top end and the bottom end thereof. The vertical support member supports an intermediate card guide which cooperates with at least one of the card guides to house a smaller circuit board within the slot by holding a top end and a bottom end therebetween. Thus, when the intermediate card guide is removed from the slot, a full vertical height circuit board card may be inserted within the slot.

Abstract: A method and apparatus to retain mounting hardware on a heat-sink or heat-pipe. One embodiment of the invention involves a method to assemble a component having a heat dissipation device with a plurality of heat dissipation fins on a substrate. A second embodiment of the invention involves a method to assemble an electrical component having a heat dissipation device with a plurality of heat dissipation fins on a substrate. A third embodiment of the invention involves an assembled substrate, an electrical component, and a heat dissipation device attached to the electrical component, wherein the heat dissipation device includes heat dissipation fins with holes to contain and shims (or clips) to make captive within the holes, the hardware used to attach the heat dissipation device to the substrate.