Patents by Inventor Jay S. Abramowitz

Jay S. Abramowitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board substrate for surface mounted components
    Patent number: 4963425
    Abstract: A laminated printed wiring board having surfaces thereof fabricated from conventional fiber reinforced laminates which are secured together by means of an adhesive fabricated of a reinforced thermosetting resin having a coefficient of thermal expansion (CTE) which is substantially smaller than the CTE of the surface laminate whereby the apparent CTE of the overall printed wiring board assembly is substantially controlled.
    Type: Grant
    Filed: March 5, 1985
    Date of Patent: October 16, 1990
    Assignee: Unisys Corporation
    Inventors: Alan M. Buchanan, Jay S. Abramowitz, Roberta A. Y. Flygare