Patents by Inventor Jay S. Lee

Jay S. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating an optical module that includes an electronic package
    Patent number: 10347615
    Abstract: Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: July 9, 2019
    Assignee: Intel Corporation
    Inventors: Myung Jin Yim, Jay S. Lee, Jong-Min Hong
  • METHOD OF FABRICATING AN OPTICAL MODULE THAT INCLUDES AN ELECTRONIC PACKAGE
    Publication number: 20180047713
    Abstract: Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.
    Type: Application
    Filed: March 24, 2015
    Publication date: February 15, 2018
    Inventors: Myung Jin Yim, Jay S. Lee, Jong-Min Hong