Patents by Inventor Jay S. Mitchell

Jay S. Mitchell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS micro mirrors driven by electrodes fabricated on another substrate
    Patent number: 7203393
    Abstract: An array of electrostatically tiltable mirrors are formed in a MEMS structure. A first SOI wafer is etched to form an array of tiltable plates in the silicon device layer joined to the remainder of the wafer through pairs of torsion beams. A second SOI wafer is etched to form cavities corresponding to the tiltable plates. A ceramic multi-chip module (MCM) carrier is formed with multiple layers of wiring and electrodes corresponding to the tiltable plates. The two SOI wafers including their handle layers are bonded together. The handle layer of the second SOI is removed, and the bonded wafers are diced into chips. Each chip is bonded to a respective MCM carrier. Thereafter, the handle layer of the first SOI wafer is removed to release the tiltable mirror plates and the torsion beams. Electronic control chips may be bonded to the MCM carrier.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: April 10, 2007
    Assignee: Movaz Networks, Inc.
    Inventors: Narayanan Rajan, Chien Hung Wu, Jay S. Mitchell, Lucy Huang
  • MEMS micro mirrors driven by electrodes fabricated on another substrate
    Publication number: 20030169962
    Abstract: An array of electrostatically tiltable mirrors are formed in a MEMS structure. A first SOI wafer is etched to form an array of tiltable plates in the silicon device layer joined to the remainder of the wafer through pairs of torsion beams. A second SOI wafer is etched to form cavities corresponding to the tiltable plates. A ceramic multi-chip module (MCM) carrier is formed with multiple layers of wiring and electrodes corresponding to the tiltable plates. The two SOI wafers including their handle layers are bonded together. The handle layer of the second SOI is removed, and the bonded wafers are diced into chips. Each chip is bonded to a respective MCM carrier. Thereafter, the handle layer of the first SOI wafer is removed to release the tiltable mirror plates and the torsion beams. Electronic control chips may be bonded to the MCM carrier.
    Type: Application
    Filed: November 7, 2002
    Publication date: September 11, 2003
    Inventors: Narayanan Rajan, Chien Hung Wu, Jay S. Mitchell, Lucy Huang