Patents by Inventor Jay S. Nelson

Jay S. Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS TO PROPOSE A SOLAR PROJECT
    Publication number: 20240176921
    Abstract: Systems and methods are disclosed herein for designing and proposing an installation of a project for a structure or site that can be based on identifying installation surface faces, installation surface face insolation, obstructions affecting insolation (or similar property), obstacles and penetrations affecting placement of installation equipment, etc., and for providing an educational experience for a potential purchaser of the system comprising general information and at least one structure-specific installation proposal. A selected plan can be implemented from within a proposal platform of the disclosed systems and methods.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Inventors: Dennis J. Strader, Ryan H. Nelson, Landon J. Anderton, Merrill E. McKee, Daniel S. Goodrick, Orrin C. Naylor, Jay D. Hamilton, Rodney P. Hovley, Cheng Zhang, Zachary K. Vollrath, Niall G. McQuay, Matthew G. Van Orman, Jacob Wright
  • Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
    Patent number: 11731207
    Abstract: Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: August 22, 2023
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Michael T. De Roy, Phillip K. Nickel, Jay S. Nelson, Andres M. Gonzalez, William A. Marquart
  • SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT BOARD USING PIN SOLDER ENHANCEMENT
    Publication number: 20230121381
    Abstract: Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.
    Type: Application
    Filed: December 20, 2022
    Publication date: April 20, 2023
    Inventors: Michael T. De Roy, Phillip K. Nickel, Jay S. Nelson, Andres M. Gonzalez, William A. Marquart
  • Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
    Patent number: 11602800
    Abstract: Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: March 14, 2023
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Michael T. De Roy, Phillip K. Nickel, Jay S. Nelson, Andres M. Gonzalez, William A. Marquart
  • SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT BOARD USING PIN SOLDER ENHANCEMENT
    Publication number: 20210107080
    Abstract: Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.
    Type: Application
    Filed: October 10, 2019
    Publication date: April 15, 2021
    Inventors: Michael T. De Roy, Phillip K. Nickel, Jay S. Nelson, Andres M. Gonzalez, William A. Marquart