Patents by Inventor Jay S Nigen

Jay S Nigen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Portable computing device
    Patent number: 8616748
    Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: December 31, 2013
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Christiaan A. Ligtenberg, Ron A. Hopkinson, Bartley K. Andre, Jeremy Bataillou, Jay S Nigen, Matthew S. Theobald, Matthew P. Casebolt, Charles A. Schwalbach, Brandon S. Smith, William F. Leggett
  • Coupling heat sink to integrated circuit chip with thermal interface material
    Patent number: 8564955
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: October 22, 2013
    Assignee: Apple Inc.
    Inventors: Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L Heirich, Michael D Hillman, Phillip L Mort, Jay S Nigen, Gregory L Tice
  • Method and apparatus for distributing a thermal interface material
    Patent number: 7961469
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: June 14, 2011
    Assignee: Apple Inc.
    Inventors: Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L Heirich, Michael D Hillman, Phillip L Mort, Jay S Nigen, Gregory L Tice