Patents by Inventor Jay Scott Rawot

Jay Scott Rawot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and Method for Substrate with Interconnects and Sealing Surface
    Publication number: 20090090544
    Abstract: A method includes providing a base. At least one lead is deposited on the base, the at least one lead including a trace of electrically conductive material having a first end and a second end. A dielectric layer is deposited on a portion of the at least one lead between the first end and the second end. A sealing surface is deposited on a portion of the dielectric layer, the sealing surface including a contiguous shape of metal separating an enclosed area of the base located inside the contiguous shape from an open area of the base located outside the contiguous shape. The first end of the at least one lead is located in the enclosed area and the second end of the at least one lead is located in the open area. Moreover, the dielectric layer electrically insulates the at least one lead from the sealing surface.
    Type: Application
    Filed: September 12, 2008
    Publication date: April 9, 2009
    Applicant: Marlow Industries, Inc.
    Inventors: Jay Scott Rawot, James Charles Williams, David Kent Finfrock