Patents by Inventor Jay Shi

Jay Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11407972
    Abstract: Methods for stimulating in-vitro Paecilomyces hepiali or Hirsutella sinensis growth, and nutritional supplement formulations containing such fungal strains are disclosed and described. In some embodiments, such a method may include providing a an effective amount of a P. hepiali fungus strain for use as a stimulating agent on a culture medium for which H. sinensis is grown and regulating the temperature to induce and maintain the growth of the H. sinensis fungus. Alternatively, a P. hepiali fungus may be grown in a similar manner using H. sinensis as the stimulating agent. In some aspects, the growth of one fungus may be sequentially switched with the other in order to improve fungi potency.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: August 9, 2022
    Assignee: NSE Products, Inc.
    Inventor: Jai-Shi Zhu
  • Publication number: 20190097204
    Abstract: Lithium ion batteries are provided that include a plurality of electrochemical units positioned within a container or assembly. A multi-layered bus bar is provided to establish electrical connection with the anode and cathode of the electrochemical units. Based on the design of the bus bar, a desired voltage and capacity may be delivered by the battery without redesign or redeployment of the electrochemical units within the container or assembly. A plurality of bus bars may be interchangeably introduced to the container/assembly to yield lithium ion batteries that deliver differing voltage and/or capacity.
    Type: Application
    Filed: July 31, 2018
    Publication date: March 28, 2019
    Applicant: Cadenza Innovation, Inc.
    Inventors: Joshua Liposky, Maria Christina Lampe-Onnerud, Tord Per Jens Onnerud, Jay Shi
  • Patent number: 7718416
    Abstract: Methods for stimulating in-vitro paecilomyces hepiali or hirsutella sinensis growth, and nutritional supplement formulations containing such fungal strains are disclosed and described. In some embodiments, such a method may include providing a an effective amount of a p. hepiali fungus strain for use as a stimulating agent on a culture medium for which h. sinensis is grown and regulating the temperature to induce and maintain the growth of the h. sinensis fungus. Alternatively, a p. hepiali fungus may be grown in a similar manner using h. sinensis as the stimulating agent. In some aspects, the growth of one fungus may be sequentially switched with the other in order to improve fungi potency.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: May 18, 2010
    Assignee: NSE Products, Inc.
    Inventor: Jai-Shi Zhu
  • Publication number: 20050260495
    Abstract: A composition having a formula LixMgyNiO2 wherein 0.9<x<1.3, 0.01<y<0.1, and 0.91<x+y<1.3 can be utilized as cathode materials in electrochemical cells. A composition having a core, having a formula LixMgyNiO2 wherein 0.9<x<1.3, 0.01<y<0.1, and 0.9<x+y<1.3, and a coating on the core, having a formula LiaCObO2 wherein 0.7<a<1.3, and 0.9<b<1.2, can also be utilized as cathode materials in electrochemical cells.
    Type: Application
    Filed: May 21, 2004
    Publication date: November 24, 2005
    Applicant: TIAX LLC
    Inventors: Per Onnerud, Jay Shi, Sharon Dalton, Christina Lampe-Onnerud
  • Publication number: 20050100794
    Abstract: A separator for an electrochemical device comprises a porous, ion-permeable material coated, on a surface thereof, a thermally sensitive layer comprising a polymeric material secured with a cross-linked adhesive and an adhesion promoter. The separator can be prepared by disposing, on a surface thereof, a thermally sensitive layer comprising heat-fusible material, a cross-linkable adhesive and an adhesion promoter, all of which dispersed in a solvent having a polar component, a non-polar component and a high boiling point component.
    Type: Application
    Filed: November 6, 2003
    Publication date: May 12, 2005
    Applicant: TIAX, LLC
    Inventors: Richard Chamberlain, Per Onnerud, Jay Shi, Jack Treger