Abstract: A printed board assembly includes a printed board, an electrical component, a first interconnect that electrically connects the component to the printed board, and a second interconnect that electrically connects the first interconnect to the printed board. In some examples, the second interconnect extends between the first interconnect and the same electrical contact on the printed board to which the first interconnect is electrically connected. The first and second interconnects provide an at least partially redundant electrical pathway between the component and the printed board.

Abstract: A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. The convection bridge is clamped between the VME electronics module and the modified chassis, requiring no modifications to the VME electronics module. For enhanced performance, additional features may include having any individual or combination of fin orientation on the convection bridge, interstitial material such as grease or indium foil can be inserted between the convection bridge and the VME electronics module, and compatible air-moving appliances such as a fan as part of the modified VME chassis.

Abstract: A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount packages. The miniature PWB is mounted on the circuit board using techniques well known in the art. This combination of technologies provides an adaptable, durable interconnect methodology, which allows for circuit and part changes without changing the layout of the base printed wiring board.