Patents by Inventor Jay Stewart MITCHELL

Jay Stewart MITCHELL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Environment-resistant module, micropackage and methods of manufacturing same
    Patent number: 10266392
    Abstract: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
    Type: Grant
    Filed: April 14, 2014
    Date of Patent: April 23, 2019
    Assignees: E-PACK, INC., THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Khalil Najafi, Sang-Hyun Lee, Sang Woo Lee, Jay Stewart Mitchell, Onnop Srivannavit
  • ENVIRONMENT-RESISTANT MODULE, MICROPACKAGE AND METHODS OF MANUFACTURING SAME
    Publication number: 20160159641
    Abstract: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
    Type: Application
    Filed: April 14, 2014
    Publication date: June 9, 2016
    Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Khalil NAJAFI, Sang-Hyun LEE, Sang Woo LEE, Jay Stewart MITCHELL, Onnop SRIVANNAVIT